Electronics Forum: rohs bga (Page 10 of 13)

QFN soldering

Electronics Forum | Sat Nov 10 23:46:36 EST 2007 | mika

BTW, The surrounded QFN fine pitch terminals should have the normal aperture reduction of 7 % in case of RoHS Senju solder paste. This works for our Telecom customer. The vias in the ground pad will be somewhat filled with solder and makes it diffi

SAC305 Lead Frame Component with Leaded Process?

Electronics Forum | Tue Sep 16 16:30:49 EDT 2008 | ck_the_flip

Vlad, yes, he made no mention of a BGA, but I thought I'd just throw it in there. Many people are concerned with the "backward compatible" scenario - running RoHS parts with a Sn/Pb solder paste. The scenario's a no-brainer with most components, bu

No Clean and Underfill

Electronics Forum | Wed Mar 04 14:35:16 EST 2009 | clampron

Good Afternoon Everyone, I have a customer who is inquiring as to the use of a no clean solder paste on their RoHS assembly. We are currently building this with OA, cleaning and then underfilling the QFN, BGA comonents after a sucessful ICT. Does any

Reflow Oven

Electronics Forum | Tue Jun 08 19:13:03 EDT 2010 | vmorina

Hi Vee, I thank you very much for the reply,and yes everything is ROHS. I am reading over the manual and looking at the differences between them. I also have a questions for you regarding stencils for BGA and other types of packages. Do you know any

Lead-free BGA in Tin/Lead Process

Electronics Forum | Tue Oct 05 15:21:48 EDT 2010 | mikesewell

Nothing wrong with using RoHS BGAs except that the spheres won't melt/collapse at normal leaded reflow temps. Reliability will questionable. Some people use a hybrid profile with a slightly higher temp (~230C)and a slightly longer TAL (60 -90 sec).


Electronics Forum | Mon Apr 16 18:30:36 EDT 2007 | coop

I use a Liberty Bandit brand hot air rework station and have placed 676 ball BGA's with very few problems. All of our products are now RoHs. They have good product support and easy to use directions. I think this unit runs about 15,000 or so. Good lu

CCGA solderability criteria

Electronics Forum | Sat Jun 21 23:15:07 EDT 2008 | mika

Also keep in mind that the CCGA column length tolerance is at minimum +/- 0.13mm from most part manufactures and they don't collapse in the same way as a BGA, therefore the paste height deposit could be critical in some rare circumstances. Board warp


Electronics Forum | Thu Sep 19 11:02:17 EDT 2013 | hegemon

If there is only a single lead free BGA on the BOM, I would suggest a "hybrid" profile. Use regular solderpaste (SN63/pb37) and peak your temperature at around 225C. Allow a bit longer TAL to let the two solders co-mingle at the BGA joints. You are

63/37 HASL Finish / RoHS Solder Paste

Electronics Forum | Sun Dec 11 22:55:22 EST 2016 | ppcbs

What type of flux is in your solder paste? Active or No-Clean? With lead free solder you really should be using an active flux. The lead free oxidizes during reflow if you are not using a Nitrogen or Vapor Phase reflow. So a more robust and activ

Lead-Free SMD repair

Electronics Forum | Mon Apr 25 12:19:21 EDT 2005 | siverts

Hi all, We produced a RoHS (lead-free) prototype order recently, and there was some components that we needed to replace on a couple of PCBA's. We found it very hard to do this even with the new solder iron. The components was just small RoHS SOIC's

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