Electronics Forum | Fri Sep 04 02:27:48 EDT 2009 | hurr
Hallo all, when I remove one from us malfunction BGAs from PCB I saw under X-ray inspection inner hairline crack.(see fig.1.) BGA was dried according to J-STD 033 and reflowed in lead process. When I look at new (baked BGA) under X-Ray inspection I
Electronics Forum | Fri Mar 05 02:59:59 EST 2010 | grahamcooper22
Hi, Do you have a picture on one of these leads where the solder has covered the lead ? As this is a gull wing device I wouldn't expect solder to cover it. I expect to see a toe fillet / wetting around the sides of the lead and a heel fillet. If your
Electronics Forum | Fri Mar 02 15:03:39 EST 2012 | davef
21. What is the recommended way to connect the sensor? Answer (Pellistors) For VQ500 series sensors please use sockets http://www.cambion.co.uk/Catalogue/Parts/1813.htm. For other pellistors connect to header legs by soldering or mechanical methods
Electronics Forum | Wed Jan 08 08:20:52 EST 2014 | emeto
To most of our boards I give 20-30% tolerance in both directions. From experience if you have big aperture on your stencil, the squeegee will scoop certain amount of paste from this aperture and you will see lower height. Depending on your board supp
Electronics Forum | Mon Jan 12 08:02:06 EST 2015 | donb_68
I am interested in seeing de-panelization routers from ASYS and CTI in action. I am particularly interested in the Divisio 5100 and Divisio 2100 series routers from ASYS and the AR2020 and MR2 series routers from CTI. For the manual machines I would
Electronics Forum | Fri Mar 20 04:09:57 EDT 2015 | robertwillis
Yes generally speaking yes if there is not contamination on the board from PCB manufacture. for dendrite formation you also need moisture and voltage during operation of the product. You can see many of my IPC Defect of the Month videos at showing yo
Electronics Forum | Tue Mar 27 01:52:23 EDT 2018 | buckcho
Hello Diego, are the components missing on the first side or the second side. Like Mr. Evtimov said, you can check before the oven the pcbs's visually and see what happens after the oven. In this way you can see if it is the oven for sure. Then there
Electronics Forum | Thu Apr 25 05:17:08 EDT 2019 | pdrirrework
Hello All, Using IR will mean that there is no minimum distance to the adjacent components as there is not hot air flow. If components are heat sensitive around the BGA you can also tape them off with a reflective tape. The IR heat will bounce strai
Electronics Forum | Mon Nov 25 10:57:31 EST 2019 | rgduval
You should be able to see the counts in the service screen for the motors while testing them...that's usually the easiest way to see if they're functioning...at least the encoders. In some of the older systems, the drive motors were all the same, an
Electronics Forum | Tue May 05 14:57:48 EDT 2020 | greezmky
I will have to check the nozzles to see if they are stuck up, but I don't believe so as I changed them all out a couple weeks ago. I have not went back to the feeder yet because I am not getting vision errors. I was able to see the diodes fly off on
