Electronics Forum | Fri Feb 14 16:01:28 EST 2020 | bk
On the my12 the panel on the front of the machine comes off two screws each corner to loosen the panel. There is a pull out tray that gives you easier access to the computer, ps3, etc. It will be the box in the center on top it should label where eac
Electronics Forum | Wed Sep 30 05:10:28 EDT 2015 | aemery
SWAG does make a good point. The tool he is talking about is located on setup page 1 in the vision box and is labeled FP Mode (Fine Pitch) mode. BY default the setting is "0" this means that once the machine is put into auto mode the camera or visio
Electronics Forum | Tue Apr 25 01:23:28 EDT 2006 | kanna
Thanks. currently we already reduce the temperature and change the bimetallic switch. can anyone help me on the alert problem. the alert trigger when the zone 1 section empty without board. current temperature setting is 187 even i lower the tem or i
Electronics Forum | Thu Jun 08 03:40:32 EDT 2006 | aj
Hi, I use convection reflow and both top & bottom settings are the same. Is the part too heavy to rely on surface tension? there is an equation that can determine this (aswell as real test i.e. part falling off) We have some SIM Card holders on bot
Electronics Forum | Wed Sep 06 03:53:49 EDT 2006 | dougs
we do a similar thing but make the template from paper, we just print out an image from the gerbers (to size) showing both sides in different colours, we set this down on the table (had to work out first where the correct position was) then we place
Electronics Forum | Thu Apr 11 14:11:10 EDT 2013 | dontfeedphils
If it's using the laser alignment try changing the part type to "SOT" instead of chip, and then enter the dimensions for only the body of the component. The "Chip" setting will measure the part half way down the body, the "SOT" setting will measure
Electronics Forum | Wed Jan 25 00:29:22 EST 2017 | cmarasigan
This is our practice already, common profile both sides and we perform it during NPI stage. As long as zone settings are the same and profile requirements are meet, we consider it as same profile and no need to re-profile from bottom side process to
Electronics Forum | Wed Oct 25 07:54:16 EDT 2000 | CAL
We were using a Glenbrook RTX then upgraded to a jewel box. We have been extremely pleased with both Glenbrook units.Glenbrook has great analytical BGA software.Glenbrook and ERSA have also teamed up to provide total inspection solution package. 973-
Electronics Forum | Wed Dec 02 06:57:18 EST 1998 | Brian Pollitt
We're using Cimetrix Host Manager to communicate with MPM UP3000 printers specifically to capture measurement and system settings and error messages. It all works fine until the printer is taken off line. The GEMComm S/W on the MPMs PC (DOS) doesn't
Electronics Forum | Wed Jan 22 15:50:23 EST 2003 | davef
Some people run underfill through their reflow oven set with a normal recipe, but at breakneck speed. We think that might not produce the cure that we'd like to obtain. We'd don't use our reflow oven because we don't want to given-up the time to
