Electronics Forum: shall (Page 10 of 22)

Re: BGA problem: open after reflow

Electronics Forum | Fri Nov 03 17:36:37 EST 2000 | Thomas Ballhausen

Thank you for your hint. According to the substrate supplier the thickness is less than 1 micron. After Ni/Co layer there is water rinse, then "gold strike", another rinse then "gold plating". But still the total Au layer shall be less than 1 micron

Re: Rework

Electronics Forum | Thu Mar 09 10:13:40 EST 2000 | Erick Russell

Hi Casey, I accept your BOLD Rework challenge. Considering you did not say what the TEST was. Let's base it on speed, thermal uniformity, and process repeatability. I have sample boards that I will take to APEX with Back to Back BGAs. Does anyone wa

Re: Siemens S20 Hang Issue

Electronics Forum | Fri Sep 17 18:33:51 EDT 1999 | Michael

| One problem we found was that when more than one person was working on the system at one time we had problems. For example one person working on the line computer, another on the machine computer and another on the VMPS system. That was usually a

Re: SMT beginner

Electronics Forum | Wed Sep 15 12:04:31 EDT 1999 | Earl Moon

| Hi, Can someone tell me how can I identify a finished product which make by SMT technology or not ? We assembly memory modules now and want to diversify our products range now. | | Thanks !!!!! | | | Ah, a fair maiden not yet sacrificed! No o

Re: Soldering Researcg Question

Electronics Forum | Tue Mar 02 23:08:54 EST 1999 | Marsellus Wallace

| Hello, | I'm doing some research for a project of mine. | I figured that since you sold things related to soldering, | you might know. | | I am wondering if there are any companies that | you know of that do manual soldering while st

Re: BGA-Problems with adhesion of the solder balls

Electronics Forum | Wed Nov 01 09:01:55 EST 2000 | Thomas Ballhausen

Since your problem has been posted quite some time ago I am eager to know, if you have got any clue. One of my customers recently claimed our 313-PBGA causing problems, as one of its balls (randomly) is almost dewetting. So no evidence is found by x-

Re: Clean raw bds

Electronics Forum | Fri Aug 14 09:37:36 EDT 1998 | Earl Moon

| Where can I find a spec to put on my fab drawing, to call out the cleanliness of the board, before I recieve it. These boards will require a tight spec after they are assembled, so I want to know that they are clean when I get them. Any suggestions

Placement Program Control

Electronics Forum | Fri Aug 17 14:28:27 EDT 2001 | Chuck N.

I like the idea that files are stored on a Lan system. Typically lans are backed up daily or weekly by the IT department. If not they should be backed up on tape or disk weekly, monthly, etc. depending on how often new programs are released. The m

solder splatter inspection

Electronics Forum | Thu Nov 29 17:30:07 EST 2001 | davef

You give no clue of what you want to write about. Let's try this: J-STD-001, 8.3.1 Particulate Matter says words to the effect of solder balls / splats shall be neither: * Loose or able to be dislodged during normal service � NOR * Violate minimu

Water Quality Requirements to wash boards

Electronics Forum | Mon Apr 15 22:37:27 EDT 2002 | davef

Regarding your customer suditor, it would have been nice if you said something like ... Routinely, our testing shall be less than 1.56 microgram/cm^2 NaCl equivalent ionic or ionizable flux residue, according to TM-650, Method 2.3.35 'Detection And


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