Electronics Forum | Fri Jun 25 14:39:59 EDT 2004 | Hoss
Any chance your potting compound was changed in the timeframe mentioned or the unit(s) were used under high heat stress conditions? If significant thermal expansion of your potting material happened and it is a hard durometer, it could shear at your
Electronics Forum | Thu Oct 13 15:34:55 EDT 2005 | Amol
Hi, We are in the process of transitioning to LF production. What are some of board materials being successfully used in production? Also, what surface finishes show promice of good results with SAC 305 solder? We are currently testing multiple boar
Electronics Forum | Tue Dec 05 09:46:50 EST 2006 | GS
I'd be shocked if Siemens was going away. They are a very big group in a very big company. Yes, but recently we have seen several big groups from a very big companies been sold out (ie. Dover and some of his kids, etc.) Asia-India are good referen
Electronics Forum | Sat Jun 23 11:41:34 EDT 2007 | grantp
Hi, We use 1:1 for 1 mm BGA and it works fine. We used it at 4 thou laser cut stencils when we had a manual stencil printer, but have moved to 5 thou with the DEK and it works ok. We originally went to 4 thou because of paste release, but the DEK
Electronics Forum | Mon Feb 18 08:56:44 EST 2008 | operator
It does exist. We used to have one here, but sold it. It was more of a manual process though. You put the assembled board on the work table and then set your cutting blade height. Then you manually moved the cutting blade around shearing off the TH l
Electronics Forum | Tue Jul 01 12:21:16 EDT 2008 | short_timer
Let�s say I want to increase the shear strength of a solder joint. Does a lot of solder around a joint create more strength? Why not just absolutely bury the component lead in solder. My initial thought is that it doesn�t increase strength, but I don
Electronics Forum | Wed Nov 26 11:19:58 EST 2008 | vladig
I don't think you can find any specs on that. As long as a solder joint can not be broken by virtually "blowing over it" any reading on the UTS, or shear strength can be very confusing. You can specify, though that the assembly (joint) should withsta
Electronics Forum | Thu Nov 12 12:05:06 EST 2009 | valeo
Up! Thanks anyway for your answer Lynn. But I'm still in the issue regarding the assembly of passive components on substrat with conductive adhesive. We hardly reach the minimum specifications of shear strengh for each component we use (1206, 0805
Electronics Forum | Fri Nov 30 05:43:27 EST 2018 | alpha1
If the part is kicking up on one side or the other make sure you've done the following: Replaced the inside formers, shoulder screws, shear block and o rings. It sounds like you have the clinch covered. Also check the driver tips. If they are smooth
Electronics Forum | Fri Oct 01 16:17:10 EDT 1999 | Dave F
| I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: | | 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Irons at
