Electronics Forum | Thu Jul 25 05:56:32 EDT 2002 | ericchua
Hello, Understand you have problem of cleaning adhesives from Dek Pump Print stencil. Well, we have a cleaning machine which able to clean solder paste and adhesives. And also, we are not using any chemical but use water-base detergent. We had few c
Electronics Forum | Wed Nov 28 09:17:17 EST 2001 | Dave G
I've heard of reliabilty problems caused by wave soldering melf's as well. We don't put Melfs on the bottom of our PCB's on newer designs. We only have to deal with gluing & putting them through the wave on some of our older legacy designs. Increasi
Electronics Forum | Wed Dec 10 11:11:04 EST 1997 | Rich Scheleski
Is there a spec for the adhesives used to hold down parts before wave soldering. What size dots are recommended and what is the maximum shear force(1LB?) tested for to ensure good adhesion. Your help is appreciated Rich Scheleski
Electronics Forum | Mon Mar 01 22:51:56 EST 1999 | Dave F
| We have customer requested machine dispension on adhesive of solder side components, however we are currently using stencil printing for adhesive. Have anyone evaluated and compared on dispension and screen printing of adhesive before? | Thanks! |
Electronics Forum | Sun Jan 11 12:03:51 EST 1998 | Bob Willis
As a basic guide the minimum spec you should look for is 500g you should achieve a force on most chip parts of 800-1000g. Parts are lost on wave soldering due to no material, poor curing, poor surface adhesion and poor handling. Its not the wave sold
Electronics Forum | Fri Dec 12 12:01:44 EST 2008 | realchunks
As the technology has changed towards surface mount, so has the applying adhesive. In the past clinching parts would have knocked off SMD parts, but no that has all changed. So applying the adhesive via screen print is common and any thru-hole part
Electronics Forum | Mon Sep 29 20:06:22 EDT 2008 | davef
One common definition of a SMD footprint is: A typical SMD footprint, is composed of: * Solder lands (conductive pattern) * Solder resist pattern * Occupied area of the component * Solder paste pattern (for reflow soldering only) * Area underneath th
Electronics Forum | Fri Sep 19 15:51:01 EDT 2003 | David Bonilla
Hi I am having solder short defects on the bottom side with SMD devices that run through the Wave solder. May you let me know any IPC guildelines about the spacing, orientation or any other design guidelines for avoid solder defects with SMD device
Electronics Forum | Tue May 23 15:01:24 EDT 2000 | A. Marques
Hello, I think the problem can be: 1.�- some humidity in the adhesive, 2.�- some bubble of air in the adhesive when you cured the adhesive some humidity will go evaporate and when you make the soldering the same soldering will make a bridge between t
Electronics Forum | Wed Aug 10 15:45:49 EDT 2011 | franxsmt
Maybe I was not clear in my original post. So we have boards that have SMD components on one side and TH components on the opposite side. We want to assemble the boards using our SMT and Wave lines. Now the problem is that if we solder the SMD firs
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