Electronics Forum: sn62pb36ag2 and gold (Page 10 of 10)

Gold plated board, with csp's and 0603 with no clean apetures

Electronics Forum | Wed Oct 02 15:20:55 EDT 2002 | Eric

Is there a steadfast rule of thumb for a good solder joint on an Enig Gold board. I come across this number 217C when discussing BGA profiles. Is this a published number? I sure could use a reference. Anybody feedback is appreciated.

Gold plated board, with csp's and 0603 with no clean apetures

Electronics Forum | Thu Sep 26 20:43:51 EDT 2002 | davef

"OK. If the connection doesn't look like I expect it to look, how do I know that the metallurgy is correct?" Comments are: * There are no pictures that will get you though this. * You should expect that gold that is dissolved in Pb/Sn solder to make

Gold plated board, with csp's and 0603 with no clean apetures

Electronics Forum | Wed Oct 02 16:13:05 EDT 2002 | babe

Have you had your solder pot tested? I find that levels of contaminants can rend a solder joint that dull look.

Re: Longer soak time and reflow time impact Solder on Au pad?

Electronics Forum | Fri Sep 08 04:45:17 EDT 2000 | PeterB

As per Travis's reply it could be something other than the reflow process. Another good one is if the printed PCB's have been cleaned down due to print misregistration etc.. If not properly controlled paste residues can remain distributed about the p

Gold plated board, with csp's and 0603 with no clean apetures

Electronics Forum | Thu Sep 26 11:44:23 EDT 2002 | abelardo

Hello everyone out there in the SMT world. I have a dilema I'm currently running a board that has 3 csp's with a .75 mm. ball pitch and .3mm ball size. And 2 qfp's-160. The stencil is 4 mils thick and I'm using a 63/37 solder paste. My reflow prof

Gold plated board, with csp's and 0603 with no clean apetures

Electronics Forum | Thu Sep 26 14:43:43 EDT 2002 | Jim M.

unsure of what solder spec. your working to?.IPC/EIA J-STD-001C, Section 9.2.4 clearly states dull, matte, gray or grainy appearing solders are accpetable depending on your process and if the acceptability of the neaxt paragraph is met.IPC 610 and J-

Gold plated board, with csp's and 0603 with no clean apetures

Electronics Forum | Wed Oct 02 18:18:58 EDT 2002 | davef

The steadfast rule of thumb is: In order to get reliable reflow, you need to be at or higher than [liquidus + 20�C] for about 5 to 10 seconds, rather than those old "60 seconds above 183�C" guideline. This provides for setting your peak based on the

Solder climbs on the lead and touches the body of the component

Electronics Forum | Mon May 12 12:58:07 EDT 2014 | emeto

Hello all, I have a diode(gold plated)on some assemblies that gives me a a hard time. The paste is wetting too good and climbs the lead of the component and touches the body which is a defect. I just wonder what if there is a way to heat the board e

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