Electronics Forum | Wed Oct 10 02:04:10 EDT 2007 | omidjuve
hi we use a no clean solder paste with the sn63pb37 alloy and our high frquency board doesn`t have any problem in test but after this product is finished now we use 2 different solder pastes 1. sn62 pb36 Ag.4 RA tape 2. NC type lead free with Ag i
Electronics Forum | Mon Nov 05 15:38:29 EST 2007 | ck_the_flip
As unlikely that this may be, if the RF circuit is sensitive enough, and the minor change in alloy is the only thing that changed, this MAY be the cause. The circuit was probably tuned to Sn63/Pb37. The reason I'm not surprised? I once had a custo
Electronics Forum | Thu Jan 03 16:46:10 EST 2008 | ck_the_flip
Stainless steel can NOT be soldered with the solder that is used in electronics, be it Sn63 or SAC305. I have 1st hand experience in this. Solder will NOT wet to it no matter how much flux is applied, or what type of flux is applied. Again, I have
Electronics Forum | Tue Aug 26 22:56:39 EDT 2008 | omid_juve
we have solderability problem(some pins aren`t soldered) with two devices in our board with the below detail EP1K30QI208-2 brand:ALTERA with the package PQFP-208 TMS320VC5416PGE160 brand:TI with the package TQFP144 these two devices are pb free but t
Electronics Forum | Fri Mar 20 05:07:16 EDT 2009 | rocko
Hi All, I was puzzled because of terrible blowholes in solder joints of gold plated odd-form components. I am very confused because all other components on the boards have perfect solder joints. Here are some process details: 1) Solder paste: N
Electronics Forum | Wed Aug 19 18:18:02 EDT 2009 | smt_guy
Thanks Sir Dave. Yeah my apologies. To clarify, we built the product PCB whcih has a Lead-Free HASL Finish using a Sn63/Pb37 Solder paste. My major concern regarding reliability is that my profile whish is between 215'C-225'C was insufficient to ref
Electronics Forum | Mon Apr 02 17:25:53 EDT 2012 | tombstonesmt
Just PM'd our Pillarhouse Jade Mark II this morning and found excessive solder balls all over the solder pot as well as the bottom of the machine. While removing all the dross it's very obvious that the dross is a REAL fine powder unlike any of the o
Electronics Forum | Mon Apr 30 18:34:35 EDT 2012 | hegemon
Pure Tin terminations can be mitigated for components with solder terminations less than .030" in height from the PCB, by using 6 mil stencil with Sn63/pb37 solder paste. That's the simple story for our customers that require it. Beyond that height w
Electronics Forum | Thu Oct 04 10:54:11 EDT 2012 | eniac
I have only one incredible idea: this is example of different speed of heat transfer of neighboring pads. I saw it two times during last years, but on lead solder pastes (Sn63Pb37). The reason of this mistakes each times we found two: 1. errors duri
Electronics Forum | Fri Jan 25 14:20:31 EST 2013 | jorge_quijano
Hi there, I have a new product today, after reflow oven I've seen a black stain coming from various holes, they can be cleaned with a tissue but some of the contaminant remains inside, we are using Sn63Pb37, the stains are far from soldering areas, t
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