Electronics Forum | Fri Nov 07 16:00:45 EST 2003 | Don A
It would depend on how many boards and parts you need to build. I would prefer an etch cut as it leaves the the part intact and you get the strength of the solder joint. It also reduces the handling of the BGA and associated damage from that
Electronics Forum | Mon Dec 05 12:41:40 EST 2005 | stepheniii
thermal cycling chemical reactions (can occur slowly) they were only touching before and not really a solid solder joint
Electronics Forum | Tue Nov 04 16:32:22 EST 2003 | Marc
Marc, I agree with Dennis. Your best method is to apply solder mask over the pads, then install the BGA. You can also remove the balls or completely remove the pads, but it take a skill person to do it. We do all that type precise rework in Southern
Electronics Forum | Tue Jan 29 15:48:31 EST 2002 | davef
On his site "SMT In Focus", our friend Brian Sloth Blitzen lists the following sampling of lead-free [no lead] links: * Alpha Metals: http://www.alphametals.com/lead_free/index.html * Circuits Assembly magazine: http://www.circuitsassembly.com/db_ar
Electronics Forum | Wed Oct 29 22:41:42 EST 2003 | msimkin
Our design team have got a problem. We need to either drill out 6 vias/pads for a BGA site, or remove the solder balls form the BGA before they are palced. ( std eutectic) Has anyone used a vendor to remove balls from BGA (0.75mm piutch, ball size ap
Electronics Forum | Thu Oct 30 00:12:13 EST 2003 | Grant Petty
Hi, Another option we have used here in house is to remove the unwanted BGA balls with solder wick, and then to manually place them on the PCB foot print. This eliminates the pick and place machine's optical centering freaking out because the balls
Electronics Forum | Wed Feb 18 12:42:43 EST 2004 | babe
OK, if the sphere of the ball and the paste on the pad are both eutectic, 63/37 then the paste will reflow first causing a drop of the component, after which the spheres will reflow causing a double drop and a good intermettalic. You can see this by
Electronics Forum | Fri Feb 20 13:01:26 EST 2004 | Jay
First, it depends on the alloy composition of the solder. As you might know, eutectic Sn/Pb solder has the lowest melting point among available conventional solder systems. (except those based on Sn-In and Sn-Bi systems.) For example, 63Sn/37Pb - 183
Electronics Forum | Wed Sep 02 06:50:55 EDT 1998 | Masdi Muhammad
Hi, We are having problem with yield loss due to electrical fail. Further investigation shows that the failure is due to solder bridging under BGA. Has been there any study or experience on how this could occur and what we can do to prevent it. Than
Electronics Forum | Fri Oct 26 11:09:13 EDT 2007 | hussman
Even a proper solder joint will fail if the rite stresses are applied to it. Sounds like you have an over heating issues, not a solder issue.
