Electronics Forum | Wed Nov 14 20:28:24 EST 2001 | davef
Not to worry. Just run the boards through the cleaner. It will remove all the solder balls. The gross filter on your washer will collect all the solder balls. Coo eh? ;-) How to cure SM? Is your mask UV, er thermal? After learning the type, you
Electronics Forum | Tue Aug 22 14:02:02 EDT 2000 | JAX
Caumel, You should be able to find sufficient info in the archives. Solder Balls probably hold the majority of posts and should be easy to referance. You can find out what causes them in relation to board material, profile tempature, wave type, flu
Electronics Forum | Mon Sep 17 17:33:38 EDT 2012 | kq702
thank you for your reply. I felt like I was using too much heat but I thought it would not work unless I did so. I did not suspect a cold solder joint, however I did another test on a scrap board. I heated the board without my clamps attached (I put
Electronics Forum | Thu Jan 23 14:19:56 EST 2003 | Mike Konrad
Hi Randy, No-clean flux needs to be activated in order to burn off the volatiles in the flux. This normally occurs partly during preheat and certainly during the reflow or soldering process. In most hand soldering applications, an operator applies
Electronics Forum | Thu Oct 18 11:20:21 EDT 2001 | davef
Ooooo, you do have the toys, baybeee!!!! This really is not a good situation. * Leaving this OA flux res on your boards will surely affect the LT performance of your product. * That a rookie found this by noticing solder balls all over the seconda
Electronics Forum | Thu Feb 08 09:07:22 EST 2001 | Hussman
OK, without knowing the specifics, why does everyone blame the oven? Most solder balls occur around R's and C's in almost every shop I've been to. The best place to start looking is the screen printer - not the oven. Sure the oven is the last proc
Electronics Forum | Mon Jun 19 21:29:41 EDT 2000 | Jack Hou
Hi, everyone, I'm an new engineer and in charge of SMT process. Now I want to apply DOE to printing process. some questions to ask you guys. 1. how many replications do i need in each run (L8) ? 2. after printing, except solder height, volume, what's
Electronics Forum | Wed Apr 22 05:33:06 EDT 2015 | mbb
We'have been working on an issue regarding aluminium capacitor placement in PCB. In fact, we have twisted (shifted) capacitors. Through root causes analysis, we confirmed that this phenomenon is happening during reflow process (no issue on placement
Electronics Forum | Mon Nov 12 15:21:09 EST 2012 | davef
High-temp ball Sn10Pb90 + eutectic solder paste is common place for MLC reflow. Temperatures necessary to alloy the high-temp ball Sn10Pb90 and eutectic solder would be high enough to compromise interposer, board and many components. What are your:
Electronics Forum | Mon Jul 12 12:28:10 EDT 1999 | Wolfgang Busko
| I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-laye
