Electronics Forum | Wed May 12 20:32:14 EDT 1999 | Earl Moon
| Earl | | you posted a message on 1-14-99 about converting to VOC free flux. Have you completed your evaluation? Could I get a copy of any data supporting your conversion to VOC free? | | Thanks | | WDR | | WDR, We are awaiting the latest dat
Electronics Forum | Tue Feb 17 04:52:13 EST 2004 | John W
There's normally a number of reasons people want to know what melts 1st, 1 - to see if you know, 2 voiding issues - whole can of worms 3 device alignment. One of our collegues has said that most balls are Eutectic, that's in fact not totally correct.
Electronics Forum | Wed Jan 30 06:45:01 EST 2002 | yaq
Hi, Has anyone done some research (measurement/simulation) on the effect of PWB vias on solder ball temperature of the component? Would this have some effect on solder joint reliability especially during power cycling? Any comments will be appreciat
Electronics Forum | Thu Jan 31 04:48:04 EST 2002 | yaq
Hi, Has anyone done some research (measurement/simulation) on the effect of PWB vias on solder ball temperature of the component? Would this have some effect on solder joint reliability especially during power cycling? Any comments will be appreciat
Electronics Forum | Mon Aug 16 09:50:20 EDT 1999 | Earl Moon
| Hello reflow experts, | | I just wanted to know the effects of N2 and O2 on reflow furnace to the solder ball apperances. | | thanks in advance.... | | ...Omat | | Not really that much with eutectic balls and solder pasted pads and the reflow
Electronics Forum | Thu Mar 24 16:53:53 EDT 2011 | davef
Can you jumper the via to the pad?
Electronics Forum | Wed Mar 23 22:29:21 EDT 2011 | nkinar
I have a few prototype circuit boards with BGA footprints where some (but not all) of the vias have been placed too close to the pads. During reflow, some of the solder from the balls flowed into the holes. Only one of the pads under the BGA is not
Electronics Forum | Thu Mar 24 15:58:52 EDT 2011 | davef
Just build-up the boards and ship them. Be sure to inform your customer about the problem that you have with their design and ask that the via be filled and plated over to prevent the problem in the production runs.
Electronics Forum | Thu Mar 24 18:05:54 EDT 2011 | nkinar
That's really interesting, davef. How would I jumper the via to the pad? Could you elaborate?
Electronics Forum | Thu Mar 24 16:06:34 EDT 2011 | nkinar
Thanks for the reply, davef. Due to prototyping time constraints, I've been asked by the engineers if I could do something on the SMT line to salvage this prototype PCB. Could I do anything to connect the pad or fill the via? Much of the board h
