Electronics Forum | Mon Nov 15 15:27:48 EST 2004 | davef
In creating your solder balls, consider printing or dispensing solder paste on the pads of the LGA and then reflowing the paste.
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Thu Oct 23 23:38:48 EDT 2008 | pathakvj
We have 8 layer HASL PCB. We saw molten solder blobs / balls on op side of assembled PCB. (to check, if this was a bare board problem), We passed bare board as received thru, SMT reflow oven and saw solder balls on top side of board. What could be th
Electronics Forum | Thu Oct 30 19:59:05 EDT 2008 | gregoryyork
solder ball was caused by hasl process not reflow. seen before many times, look around wells of smt on bare boards should be more of them
Electronics Forum | Sat Mar 16 11:06:48 EST 2002 | Lau
Hi, I am searching a method of reflow process for less / nothing solder ball defect. Thank Lau
Electronics Forum | Fri Oct 24 06:55:48 EDT 2008 | clampron
Good Morning WS, If you experieced the solder balls after reflow of a bare board through the oven, then the source of the solder is either the oven or the board. I have had boards with untented via's that were HASL'd that had entrapped solder and fl
Electronics Forum | Thu Jul 03 12:03:00 EDT 2003 | slthomas
So, there is a crack or gap between: * Solder and component termination. Bingo Correct? Describe: * Coarseness / smoothness of the metal on the termination underneither the crack. * Solder left on the termination. Unfortunately at 45X I can't rea
Electronics Forum | Fri Sep 21 14:03:45 EDT 2001 | jschake
I have observed solder balling for all aperture sizes tested. Solder balling levels appear to be better correlated against the amount of solder paste that is underneath the 0201 component terminations after placement rather than comparing this to th
Electronics Forum | Wed Jan 17 03:35:07 EST 2001 | Arul
We have few failures similar to the discussion in this thread, on a 50 Mil pitch, 30 Mil mill Ball PBGA. Would like to understand the mechanism of the BGA reflow process bit more. Appreciate your response to the following. 1.We sheared few solder ba
