Electronics Forum | Wed Apr 22 23:25:15 EDT 2009 | jandon
We were using AIM WS485 SAC305 and AIM NC257 SAC305 and we had problems with voiding and AIM�s narrow process windows. Now we are using Indium3.2 and Indium8.9 with much better results.
Electronics Forum | Fri Jan 28 12:45:14 EST 2005 | Indy
That is what we call as good "Problem Solving Skills". :)
Electronics Forum | Sat Dec 10 05:39:32 EST 2011 | svijais
Dear Friends, I would like to know whether any of you evaluating with Low Temperature Solder especially Tin-Bismuth-Silver COmbination. If you have any feedback/articles/evaluation/reliability/Yield Reports, please share. Regards Vijai
Electronics Forum | Sun Dec 28 15:19:49 EST 2008 | davef
A long time ago, Phil Zarrow wrote �Evaluating solder paste - not an option� to give tools for evaluating various solder paste properties. You are interested in �post placement tack.� Find Phil's paper at: * His site http://www.itmconsulting.org *
Electronics Forum | Thu Apr 27 17:28:00 EDT 2017 | methos1979
At the time we purchased our MV-3L our smallest component was the 0805 so we got the 5 megapixel down camera although I don't remember the resolution but it was not the most fine one they had. We've since added 0604 components and solder evaluation i
Electronics Forum | Tue Jul 06 10:46:12 EDT 2004 | blnorman
We have now switched to Kester EP256. During our solder paste evaluation, resistance to humidity was one of the selection criteria. We printed multiple boards, then exposed them to 85�F/65% RH. At 30 minutes, 1 hour, 2 hours, and 4 hours exposure
Electronics Forum | Tue Apr 17 22:55:28 EDT 2007 | davef
Look for �Evaluating Solder Paste - not an Option� here: http://www.itmconsulting.org/smt_articles.html We have no relationship, nor receive benefit from the company referenced above.
Electronics Forum | Mon Mar 03 23:24:06 EST 2008 | Mag10
I have a project to evaluate solderability of various metals or plated finish. I'd like to tap in to get some advise. The project is to evaluate solderability of various metals or plated finishes for RF shield application with reflow. Due to the hig
Electronics Forum | Tue Mar 08 19:37:17 EST 2011 | Jacki
Hi We did some evaluation to solder 0.4mm pitch by Wave. We found that there were many solder shorts at Sockets pins so it made touch up time longer. Please advise me someone has achieved the fine pitch soldering by wave. Thanks in advance.
Electronics Forum | Tue Jan 06 09:33:06 EST 2009 | blnorman
Years ago when we ran a solder paste evaluation we used the 2.4.44 method mentioned above. What we did was to print several coupons and let them sit for various times to see how the tack changed over time. Our goal was to see how long after print w
