Electronics Forum | Thu May 09 12:00:32 EDT 2002 | russ
One thing I have done in the past although it may not be feasable in your case, is to process through normal reflow and then saturate parts with a high solids water soluble flux and re-reflow with hot air, iron, or even another pass through the oven.
Electronics Forum | Mon Jul 01 13:25:31 EDT 2013 | tpost
I think it is wetted also but I cannot verifiy without actually seeing the toe, heel or side fillets. In this case, the lead was overhanging the pad and as with this type of lead it is not acceptable so they were reworked. Many times rework personel
Electronics Forum | Mon Jul 01 13:19:55 EDT 2013 | emeto
I always look for a toe fillet if the design allows you to. Many times the pad design is close or exactly the size of the leads which makes people to touch it up right away. I told them hundred times not to but...Luckily I have 3D x-ray and I can tel
Electronics Forum | Fri Aug 02 18:30:45 EDT 2013 | hegemon
We use our Yestech and Mirtec to do that same thing. Verify the lead is in the hole and check the solder fillet. This is done as part of our normal solder inspection for mixed technology high runners. You may not be able to put together a program
Electronics Forum | Tue Feb 03 06:52:45 EST 2004 | paul_bmc
About 2 years ago our company tried to go with a post reflow AOI inspection. This AOI was suppose to be able to inspect to a level class 3 product. **It is impossible** You cannot inspect for a heel fillet and inspecting for poor wetting is a very
Electronics Forum | Thu Jan 27 11:23:45 EST 2005 | russ
Well first off I wouldn't evaluate paste for a wave process. I would use solder bar instead. Flux - top side fillets and no shorting on the solder side, does it clean well after processing if using water soluble flux. How wide is the process win
Electronics Forum | Thu Aug 28 16:13:06 EDT 2003 | Dan Gosselin
Thanks everyone for your help. I have since found a good article I am downloading of of the SMTA website. Dan Title : EFFECT OF SURFACE TENSION OF SOLDER ON UNDERSIDE DEVICE SUPPORT DURING REFLOW OF A PCBA Author : Mulugeta Abtew Author Company
Electronics Forum | Tue Aug 20 13:01:48 EDT 2013 | sevenzero
I read through this thread somewhat and checked out the pictures. I've programmed TH lead checks on a newer Yestech and an older Mirtec. I personally use the Yestech white-top/histogram check and the only solder inspection Mirtec has. In my experienc
Electronics Forum | Wed May 08 23:18:58 EDT 2002 | ianchan
Hi mates, have this SMT production issue : A) We have a leadless-chip-carrier(LCC) IC package that is classified under the Land-Grid-Array(LGA) package family. B) The LCC is 4mm x 4mm, and has 28 tin plated pads located beneath the outside perimet
Electronics Forum | Wed Aug 03 21:29:59 EDT 2005 | Ken
Yes, lead can promote fillet lift. In order to understand this defect you must begin looking at your lead frame mateials. some lead frames are more susceptable to this disorder. This is most likely a cte mismatch disorder. Lead contamination in
