Electronics Forum | Tue Sep 22 09:07:02 EDT 1998 | Steve Gregory
Hi Jacqueline! Do these joints that you're having problems with happen to be on fine pitch solder joints? Are the fillets staying attached to the foot and separating from the pads cleanly? If that is true, are there many vias concentrated aroun
Electronics Forum | Tue Sep 22 09:59:15 EDT 1998 | Mike C
| Hi Jacqueline! | Do these joints that you're having problems with happen to be on fine pitch solder joints? Are the fillets staying attached to the foot and separating from the pads cleanly? | If that is true, are there many vias concentrated
Electronics Forum | Tue Sep 22 12:25:31 EDT 1998 | Chrys
| | Hi Jacqueline! | | Do these joints that you're having problems with happen to be on fine pitch solder joints? Are the fillets staying attached to the foot and separating from the pads cleanly? | | If that is true, are there many vias concen
Electronics Forum | Thu Feb 19 12:52:08 EST 1998 | Earl Moon
| what is your experience about the presence of the voids in the joints ? | Are they dangerous and when ? My specifications require rejection and study if voiding exceeds 2% of solder joint volume measured using x-ray and/or x-sectional analysis. My
Electronics Forum | Mon Dec 22 16:02:22 EST 1997 | Justin Medernach
| what is your experience about the presence of the voids in the joints ? | Are they dangerous and when ? Vincenzo, Voids in solder joints can be caused by a number of factors. Let's begin with the flux vehicle in your soldering media. If the prope
Electronics Forum | Thu Sep 29 19:18:24 EDT 2005 | HLy
Hi, I noticed that the solder joints on my BGAs end up with a lot of wrinkles after reflow. See picture at: http://pstr-r02.ygpweb.aol.com/data/pictures/02/01A/17/DD/E3/9E/n8BhepQLFDs6GMSwaRNxPCTWR5NdpUJZ0300.jpg Does anybody have any ideas what cau
Electronics Forum | Sat Nov 03 09:29:17 EDT 2007 | davef
IPC-9701, SMT Solder Joint Reliability Qualification and Performance Standard is an update of D-279, Design Guidelines For Reliable SMT PCA that includes BGA and PbFree
Electronics Forum | Thu Jun 09 06:15:17 EDT 2005 | Clampron
Joseph, We have all been using lead free components for some time. Many passive already have a Pb free plating and we have not seen catastophic failures on them. From the information I have seen, I think this should be OK (with the exception of BGA'
Electronics Forum | Fri Nov 09 19:31:43 EST 2007 | yshiau
Thank you to Dave and Scott!! What I'm delaing with is mass production test for small memory cards in volume! The reason I choose Non-operating temperature cycling is so that I can deal with volume. I can throw in quite a few memory cards in chambe
Electronics Forum | Fri Oct 07 09:19:54 EDT 2005 | Kris
the direction in which the solders cool in a BGA are also different than the rest of the boards as the joints " hidden" to ambient. Refer to an analogus phenomenon in the cookson application note. http://www.cooksonsemi.com/pdfs/How%20&%20Why%20Bum
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