Electronics Forum | Thu Apr 05 13:54:18 EDT 2001 | CAL
Do the parts sit directly on the PCB? Typical 2.0 mm Max is desired for the component to be off the PCB. Are stand-offs an option? The long lead wiggles as it passes through the wave and thus agitating the air out.Does your wave a "dancer" option?
Electronics Forum | Fri Apr 06 07:32:33 EDT 2001 | Claude_Couture
Thanks for the tips. I'll have to check with the designers if they can accomodate the height if I was to use parts with stand-off. The bigger holes was already suggested, but they don't want to change them until a new revision on the product comes o
Electronics Forum | Fri Apr 06 07:32:54 EDT 2001 | Claude_Couture
Thanks for the tips. I'll have to check with the designers if they can accomodate the height if I was to use parts with stand-off. The bigger holes was already suggested, but they don't want to change them until a new revision on the product comes o
Electronics Forum | Sat Dec 11 12:15:21 EST 1999 | Steve Thomas
We have a pretty challenging board (2-up panel, 15"x20", 48 20mil pitch QFP 100's and 2 25mil QFP128) that gives us LOTS of lead bridging on the 20 mil parts. There is typically very poor wetting on these parts also, and some joints just flat aren't
Electronics Forum | Mon Mar 22 19:46:17 EST 2004 | pdeuel
The bottom side is going into reflow somewhare near melting point of solder. Reduce bottom side temprature. Get a good mole so ramp and soak tempratures can be checked on bolth sides of the PCB. The object is to keep bottom side parts from approching
Electronics Forum | Fri Apr 06 11:37:19 EDT 2001 | raton
We had the same problem years ago when we started using a radial inserter. The inserter would dutyfully insert and clinch the leads. The problem in our case was the component body sealing to the fab, especially on electrolytics caps with a film jac
Electronics Forum | Thu Oct 26 09:10:30 EDT 2000 | ptvianc
I am not familiar with the "HALT" terminology. Do you mean HAST testing? As for thermal fatigue, the most severe conditions are typically those cited for military and/or satellite applications. There are several temperature ranges that are used to
Electronics Forum | Mon Oct 29 20:19:44 EST 2001 | davef
DON'T do it!!! The two problems you'll have are: 1 Poor manufacturing process control, resulting in weak solder connections. 2 Weak solder connections are stressed, when the board is straightened upon installation in the "box". There's several hits
Electronics Forum | Fri Apr 06 16:19:12 EDT 2001 | davef
We build a mixed tech [eg, QFP, SMT fly shit, DIP] board where we can't clinch the DIP. So we set the clinch and cut on the DIP to just barely clinch, leaving the leads very perpendicular to the board. I wonder if you could do something similar wit
Electronics Forum | Sat Nov 25 03:51:04 EST 2000 | carsonho
HALT is an approach to stimulate a failure till its existence. It is mainly used during product design and development phase. Traditional tests are mainly used to prove "no" failure but HALT is to make failure for information to improve in design of
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