Electronics Forum | Mon Jan 18 20:51:29 EST 1999 | Dave F
| Can anyone recommend ways of reducing damage to solder masks ... a new wick perhaps. I find that using standard wicks the imposed damage is un-acceptable. | | Also any good links on the subject of bga rework would be really appreciated | | in ear
Electronics Forum | Wed Aug 10 11:57:16 EDT 2005 | pr
Is the peelable mask (put on by the boardhouse) flat on the surface of the pcb? If so can you tell me the material name, so maybe I can find a picture? We have to print adhesive on the board, so the mask has to be flat. That is why Kapton from the b
Electronics Forum | Fri Oct 18 00:44:56 EDT 2019 | Aqueous Technologies
I know you mentioned you use a Tech Spray product. We have had success with their "Wondermask" water soluble product. When using a chemical additive (saponifier) in an aqueous cleaning system we have not experienced residues. I hope that helps. https
Electronics Forum | Tue Nov 09 20:52:34 EST 2010 | ppcbs
Yes, we have had this happen with certain solder masks over the years. Hot air gun is the best solution we can find if the oven doesn't do it. Back in the day when we had a vapor degreasor, freon based solvents would also remove the clouding. Let
Electronics Forum | Thu May 28 22:12:18 EDT 2009 | davef
If your newer board passes a tape test, you should be OK.
Electronics Forum | Mon Nov 08 15:10:52 EST 2004 | russ
We usually get some mask material from our board house. It cures with heat so it works really well in our applications. Be wary of the "overcoat pens" they don't seem to hold up under heat and thre solder will flow right underneath it during BGA a
Electronics Forum | Thu Nov 11 13:00:20 EST 2010 | 18424
Thanks Dennis, The fact that someone other than myself has experienced this is good to hear. Solder mask type should be spec'd all the same through out the many board suppliers we use but its worth the check.I have checked with kester but am still aw
Electronics Forum | Fri Aug 20 03:19:22 EDT 1999 | PeterB
| | | | | | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate conta
Electronics Forum | Tue Aug 09 13:25:24 EDT 2005 | pr
From what I can gather, the annular rings are used for grounding when these boards are put in housings. A screw goes through the hole and is torqued down. If there is excess solder on the annular ring, the screw doesn't seat properly. The pallets cov
Electronics Forum | Tue Aug 09 12:12:57 EDT 2005 | davef
Why are you placing Kapton dots on your board prior to wave soldering? * Prevent solder from touching the hole and the area around it. [If so, why do you need to do this?] * Prevent solder from flowing up through the hole and coating portions of the
