Electronics Forum | Mon Dec 02 16:19:11 EST 2002 | slthomas
Unfortunately it's nc or we'd be worrying about this on the fly. Non-contact is defintely and issue....this is an 18"x9" board with 1500 bottom side SMT parts that are scattered among the through-hole and vice-versa. We're currently using 7 hold-
Electronics Forum | Fri Apr 10 18:51:39 EDT 2009 | boardhouse
Hi Jeff, Your board supplier could be correct in this way. The board could have had just a hair left of copper on the circuit, which would hold up under the electrical test process, but once you powered it up, then there was enough juice to burn th
Electronics Forum | Fri Apr 29 14:16:16 EDT 2011 | ppcbs
Below is the long explanation. This defect is most commonly found with BGA components, but can arrise with all components. I see it happening more now with lead free boards that are being assembled with a no clean flux. Best short term remedy is t
Electronics Forum | Fri Apr 06 11:37:19 EDT 2001 | raton
We had the same problem years ago when we started using a radial inserter. The inserter would dutyfully insert and clinch the leads. The problem in our case was the component body sealing to the fab, especially on electrolytics caps with a film jac
Electronics Forum | Wed Jan 15 11:18:51 EST 2020 | avillaro2020
Hi Evtimov, Thanks again! The solder wicking/open solder joint is not actually gross rejection, it is only a few and appeared random (difficult to trend the location of the opens), what is perflexing is that i have this 1 or 2 open solder joints sur
Electronics Forum | Mon Sep 20 13:04:25 EDT 2004 | davef
The Intel BGA Developer�s Guide [ http://developer.intel.com/design/packtech/ch_14.pdf ] says: 14.8.3.3 Plated Through Hole (PTH) Isolation Regardless of the technique used for the mounting pads shape or definition, isolation of the plated through h
Electronics Forum | Fri Jul 06 03:23:01 EDT 2001 | kennyhktan
Hi there Steven ! Please allow me to share some of my problem we're facing here with you. Here are a few points that I suggest you should check on your current process:- (1)PCB - Component land partern design ? It is per IPC spec ? - Mask
Electronics Forum | Thu Oct 08 14:04:04 EDT 1998 | Kris Ewen
Manish, I've seen similar phenomenon when processing CSPs on our cards. In our case, we were placing the components over the opening to in-pad blind vias. Due to poor drilling and plating processes by our board suppliers, volatiles were outgassing
Electronics Forum | Fri May 26 21:25:52 EDT 2006 | mika
Yes we do place "big and heavy" SMT DC/DC:s on most of our board's. Please tell us what brand it is or at least what the package look like?!? For instance we place a different numbers of "heavy" DC/DC converters (40x20mm & 45x25mm) that has the pick-
Electronics Forum | Fri Aug 20 03:19:22 EDT 1999 | PeterB
| | | | | | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate conta
