Electronics Forum | Wed Nov 24 17:09:41 EST 2010 | bandjwet
We are working on placing an RF shield. Sometimes we have been dispensing paste (if the board is already populated), othertimes we have been printing the paste pattern (unpopulated board). Now we have a case where the customer is insisting on a pre
Electronics Forum | Tue Aug 14 08:19:45 EDT 2018 | buckcho
Hello, other colleagues gave you valid ideas. I found it helpful if i reduce the size of the cooling openings. I would suggest making the four big square into very small many diamonds. This would maybe decrease your voiding with 2-4 percent. Btw how
Electronics Forum | Wed Jun 29 12:31:32 EDT 2022 | proceng1
I don't know about that paste, but I can give my experience trying intrusive reflow (pin in paste). Using standard Lead-Free paste, we often had issues. It seems that many ROHS parts can't actually handle reflow ROHS temperatures. So the fact that
Electronics Forum | Thu Feb 18 17:15:24 EST 1999 | Jason Gregory
Check this company out....Winslow Automation. They have a real easy "preform" for reworking BGA's. You just wick the old solder off, flux the packages, attach an appropriate preform, reflow it with a corresponding profile, remove the water-soluble pa
Electronics Forum | Thu Aug 31 04:56:44 EDT 2023 | auriga2001
I would start with the following possibilities and solutions: Add extra solder to the pads with a Camalot dispenser; or preformed solder slugs placed as an additional component if there is enough extra pad to attach it without interfering with compo
Electronics Forum | Mon Aug 26 09:50:32 EDT 2002 | zanolli
I want to ascertain the oven profile required for through hole connectors with solder pre-forms. I need to get double sided PCB�s made for that purpose. What is the best way to get these PCB�s made to simulate real world conditions?. Should I leave a
Electronics Forum | Thu Jul 05 08:11:45 EDT 2007 | naynayno
This is wave soldering process and design question since most folks associated with SMT are processing mixed assemblies. We have a 3-leaded sensor (radial) with such a tight pitch always bridges. Solutions unders disussion are pre-forming and addin
Electronics Forum | Tue Jan 09 21:21:22 EST 2007 | behrsam
I am soldering a Germanium Window with a metalized rim to a Ni-Au plated kovar lid. The solder joint needs to be hermetic. I am using 80In solder washer shape preform, but am experiencing lots of voiding when x-rayed, although the joint is sealing.
Electronics Forum | Mon Aug 26 20:33:50 EDT 2002 | davef
Not as such. Generally, people tailor their profiles to produce glam solder connections on their boards. Search the fine SMTnet Archives for discussion on the factors affecting solder reflow recipes. What is the best way to get these PCB made to s
Electronics Forum | Tue Sep 29 21:39:07 EDT 2020 | kylehunter
Hi, We are currently working on a board that has 3x 50-pin THT at 1.27mm pitch each. This is too small for us to be able to consistently do on our selective solder. We are instead considering pin in paste. The connector we are using can be spec'd at
