Electronics Forum | Fri Jan 15 03:30:10 EST 1999 | Jeff Sanchez
| Hi all, | | I thought I'd use this forum to ask a couple general questions on fluxes for manual operations: | First - Is it OK to use a wave soldering type flux (specifically OA)? Thinking about activation temperatures and the ramp rate of the wav
Electronics Forum | Mon Jun 21 09:58:25 EDT 1999 | Christopher Cross
| | Now don't everyone jump on this at once, but it seems time for me to send out copies of my not even close to being dated copy of an article about HASL. Though it was published in 1992, in Printed Circuit Fabrication Magazine, and it got rave revi
Electronics Forum | Wed Jun 24 23:52:41 EDT 1998 | Phillip Hunter
| Has anyone seen a problem with solder under chip components, in-between the glue and the component or in-between the mask and the component? We seen both. | What could be causing this? This has only been detected on one of our products. All the re
Electronics Forum | Tue May 08 11:27:49 EDT 2001 | Eyal Duzy
I will review some of the advantages/disadvantages of AOI vs. X-Ray one by one according to the main differences that you may find between them. * AOI uses optics that can "see" only visible elements. X-Ray can "see" hidden elements. There is a ve
Electronics Forum | Sun Feb 05 17:44:47 EST 2017 | spoiltforchoice
Printer->Paste Inspection(which might be a feature of the printer)->High speed placer (for all the little parts)->Accurate Placer(for your BGA Processor,RAM,eMMC and big things that don't fit in the high speed)->Reflow oven->AOI->PCB stacker All of t
Electronics Forum | Tue Oct 10 08:51:26 EDT 2000 | John
Thanks for the responses, and I tend to agree. I would much rather go through a more structured continuous improvment process (set goals, meet them, set new goals and so on). Our company is rather small and made the jump from all through hole to mi
Electronics Forum | Thu Jul 15 11:01:06 EDT 1999 | Earl Moon
| | Hello All, | | I am setting up a line to mount CSP/uBGA devices and now am looking at the X-Ray process. It is my opinion that this should be done offline - can you tell me if Im right or do I need to put one inline? | | Also anyone who is mou
Electronics Forum | Tue Feb 23 11:09:12 EST 1999 | Steve Gregory
Hi Dave! Dat' be da same board we ran at NEPCON East in 97'! Ray Rua was running the TAC line then (his company usually runs the TAC line at almost all NEPCON shows). A couple of things I wanted to point out on that GIF image that might b
Electronics Forum | Wed Sep 11 07:37:11 EDT 2002 | mk
Whoaaaa Genny, Its not that bad!!! The difficulty factor is in assembling your own boards is all releative to how many, and how difficult they are. Most studies show that the vast majority of defects in smd assembly are generated in the application
Electronics Forum | Mon May 20 21:29:52 EDT 2002 | davef
Q1: Are we saying then that IMC can occur at the solder / Cu pad join on the PCB when finished assembled? A1: Yes, but in a broader context I am saying that when someone solders correctly, they form an IMC. Q2: Will the tin diffuse with the Cu over
