Electronics Forum: solderability issue. (Page 10 of 307)

Soldering issues lately!!

Electronics Forum | Thu Sep 11 20:32:08 EDT 2008 | diesel_1t

I know that most of the problems are called solder issues, this is why i put "solder related" quoted because i have seen more than usual "solderability issues" posted on this forum lately. I had a tombstoning issues with 0603 resistors, on some mat

QFP Shifting / Solderability Issue

Electronics Forum | Tue Jun 05 15:34:05 EDT 2007 | aj

Hi all, Just to close off this issue I was having - the customer supplied a new batch of components and there was no issues . Looks like the whole of the previous batch was effected with solderability problems. Thanks for all the replies. aj...

Moisture absorption in the solder paste

Electronics Forum | Mon Nov 07 06:16:59 EST 2005 | laxman

Hi, We have faced the solderability issue (Dewetting and solder balls)in all the Boards after reflow.When we found this issue we discarded the old paste and started using the new paste then for some hours the solderability found to be O.K. After so

QFP soldering issue

Electronics Forum | Mon Jan 12 08:59:57 EST 2004 | Paul F

I may have a similar problem at the moment with a QFP-68. Do the unsoldered leads leave a perfectly formed footprint in the reflowed solder? Do you usually find this issue occurring towards the corners of the QFP rather than in the middle of a row?

QFP Shifting / Solderability Issue

Electronics Forum | Mon May 28 03:36:46 EDT 2007 | aj

Hi All, We have a QFP device that is struggling to achieve acceptable solder joints. I have noticed one or two of the components shifting during reflow. I can adjust the Blowers but I dont have any issues on other boards. This seems to be a straigh

QFP soldering issue

Electronics Forum | Thu Jan 15 15:08:43 EST 2004 | mrmaint

Are your qfp's being stored properly. I have seen this in the past and it turned out to be a moisture issue. We saw most of the problems on the corners. The component would swell during the reflow process thus lifting the corners. After baking the re

QFP Shifting / Solderability Issue

Electronics Forum | Thu May 31 19:45:47 EDT 2007 | diesel_1t

We place a QFP 256 leads 20 mil pitch, had a lot of troubles with shifted components and solderability issues. solderability is not a problem anymore; we solved with a ramp-to-spike profile with .9�C/s 'til 183� then spike to about 118�C, TAL ~60s. W

SMT Custom connector soldering issue

Electronics Forum | Mon Oct 29 19:48:03 EST 2001 | davef

Sounds like the connector is not solderable. * Do they take solder when hand soldering? * Do they take solder when using a hotter flux than you normally use? * What flux are you using? * What are the materials used in fabricating these connector le

Reflow solder issues with 6pin SOT's

Electronics Forum | Tue Aug 09 12:09:26 EDT 2005 | mtd

I am having reflow issues with small 6 pin SOT's. The joints on these components still look like solder paste after the reflow oven. I have tried adjusting the profile on forced air oven. Any recommendations as what to change in the profile or proces

XBOX 360, BGA ball problem?

Electronics Forum | Fri Oct 26 11:09:13 EDT 2007 | hussman

Even a proper solder joint will fail if the rite stresses are applied to it. Sounds like you have an over heating issues, not a solder issue.


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