Electronics Forum | Wed Nov 29 11:46:57 EST 2006 | slthomas
IPC 610 *C* states that the solder thickness requirement is a properly wetted termination is evident. Fillet height is another aspect and is usually specific to the package but is some function of solder thickness plus a percentage of lead height. D
Electronics Forum | Sat Sep 06 05:11:21 EDT 2014 | padmalathab
Hi Thanks for responding to my query. Our PCB Assembly consists of both SMD and THD components. Also,assembly will be done by machine as well as Hand soldering based on the requirement. I request you to suggest Poka yoka tool to read the value of
Electronics Forum | Wed Jun 18 18:24:07 EDT 2008 | jensteele
Does anyone know of an established guideline for thickness requirements? Our smaller pads continue to receive a thicker solder deposition when we measure by the larger pads for process accessibility and vice versa for the larger pads when we measure
Electronics Forum | Wed Aug 07 11:55:31 EDT 2002 | slthomas
Ron, have a look at http://www.fda.gov/cdrh/dsma/cgmphome.html It would be a nightmare, if your plant is not structured to support it. It's a huge pain in the fanny even when you (alledgedly) are. I'm not sure what you're pursuing, but if you're c
Electronics Forum | Mon Aug 10 15:15:17 EDT 2009 | indity
I have very little knowledge of pick and place machines or assembly, and was hoping someone could give me some advice of where to start looking. I do learn quickly so I am not afraid of challenges or learning through mistakes. I need to produce abou
Electronics Forum | Tue Aug 18 22:22:43 EDT 2009 | comatose
Assuming you want to run 8 hours a day and 5 days a week, you need a sustained throughput of 2.5k components per hour. With fine pitch, futzing around, setup, etc you should really look for machines rated in the 4k to 5k per hour range. That's not sc
Electronics Forum | Fri Oct 12 08:19:12 EDT 2007 | davef
Michael We know you're just trying to have fun by getting us to respond. Going along with the game, if your solder is more expensive, requires more energy to melt, produces less reliable solder connectiuons, and is worse for the environment; how to
Electronics Forum | Thu Sep 03 22:03:32 EDT 2020 | SMTA-64386139
Both conditions are acceptable for this bottom brazed flat pack package. The solder coverage must be within 0.070 inch of the lead/package interface per MIL-PRF-38535, paragraph A3.5.6.3.4.a. While that requirement could allow for a gold gap near t
Electronics Forum | Tue Jan 31 12:02:22 EST 2006 | aj
how would you apply both pastes.? anyway, I have succesfully run leadfree bga with lead paste. You gotta find a profile that kinda meets both requirements. Taking into consideration the peak temp and time above. dont have details on hand but I ca
Electronics Forum | Tue Aug 11 17:36:44 EDT 2009 | dyoungquist
You are looking for a complete SMT assembly line plus possible X-Ray inspection and rework equipment. The 3 components of the SMT line are stencil printer, pick-n-place machine and reflow oven. How small are your components? 0603? 0402? What is the