Electronics Forum | Thu Nov 10 08:23:35 EST 2005 | arclightzero
Hello, I am currently trying to isolate internal fallout problems with very low yield substrates mixed with great yields and have recently found that we are using a Sn62/Pb36/Ag2 solder paste with full tin (no lead) components as well as Pb95/Sn5 sol
Electronics Forum | Wed Apr 30 12:26:10 EDT 2008 | dphilbrick
There must be discussions about this on SMTnet but I have yet to find them. I would like to hear from all you smart people about running LF and PB BGA�s on the same board using 63/37 solder. If you run your profile up to peak at around 225C +/- (nitr
Electronics Forum | Tue Aug 23 03:29:37 EDT 2022 | samhe
I received a buck-boost DCDC board with an optical sensor from NextPCB, so I mounted the components and measured the efficiency. Table of contents Board received from NextPCB Solder paste printing Mounting of parts Reflow operation check Attaching
Electronics Forum | Thu Sep 04 03:26:18 EDT 2014 | eurekadrytech
Hi all: Interesting question you have raised as it concerns the rate of absorption by the board material. I represent http://www.EurekaDrytech.com and could assist in resolving the blistering problems you're facing. First some questions. 1. Is the
Electronics Forum | Mon Sep 08 21:12:29 EDT 2014 | eurekadrytech
Hello, Manufacturing process with high moisture and humidity environments and long term storage will definitely see pop corning effects once high temperature from soldering and/or re-flow process. The moisture that has been adsorbed is likely the ro
Electronics Forum | Sun Sep 07 20:51:52 EDT 2014 | natashakt
1. Is the high RH environment consistently at 72% RH and 21.4 degrees Celsius? No, over the past 2 weeks I have recorded the highest at the moment: 67% RH at 22.6 degrees C and lowest (it is Spring not summer yet): 31.9% RH at 19.0 degrees C. Or d
Electronics Forum | Wed Jan 06 04:51:16 EST 1999 | Earl Moon
| | A question for you all! | | | | Back in the good old days, we didn't always know how clean was clean. Much has changed. Much hasn't. | | | | My question concerns cleaning under, through, and around tight spaces. Way back when, we could not clea
Electronics Forum | Tue Oct 12 17:40:01 EDT 1999 | Brian W.
| | | A question for you all! | | | | | | Back in the good old days, we didn't always know how clean was clean. Much has changed. Much hasn't. | | | | | | My question concerns cleaning under, through, and around tight spaces. Way back when, we coul
Electronics Forum | Mon Jun 16 14:39:49 EDT 2003 | stepheno
The second one is typical. The important temperature is the temperature of the joint, not the setting of the oven. The oven setting are only important because they determine the temperature of the joint. If you set the oven to 150, that will be th
Electronics Forum | Mon Dec 11 20:44:37 EST 2006 | davef
Title : LEAD-FREE WAVE SOLDER FLUX EVALUATION Author : Michael Havener Author Company : Benchmark Electronics, Inc Date : 09/25/2005 Conference : SMTA International Abstract : The European Union�s deadline to ban lead in electronic pr
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