Electronics Forum | Mon Nov 07 07:50:41 EST 2005 | pjc
6 deg is std angle. Some machines have option to adjust angle from 5 to 7. Maybe yours does. If you have an Electrovert wave machine you can get the Omega option. This option vibrates the wave to reduce surface tension. It does a nice job on rectangu
Electronics Forum | Thu Jul 20 16:08:18 EDT 2000 | Grant Baynham
Do you have any experience with flip chip applications using lead-free solder, and specifically do you have any information revealing how the process parameters for standard air reflow atmosphere can be modified to match the results for solder reflow
Electronics Forum | Mon Nov 07 04:43:02 EST 2005 | lupo
About the anlge typically is 5-7 depending on the machine. If solder smt components, the best is to use (swich on) double wave machine - (swich on both) chip and laminar wave. Regards.
Electronics Forum | Wed Apr 18 04:22:43 EDT 2007 | ray
I facing dewetting problem on Ag/Pd termination(chip component)during reflow process. The solder wetting is pull to terminal side and exhibits dewetting. Any one ever face the same problem and any solutions for the problem?
Electronics Forum | Fri Aug 30 16:47:56 EDT 2002 | davef
Ooops, sorry Peter. [Those pesky decimal points.] I meant to say �150-200 thou�. There is a fair amount of 'Kentucky Windage' in this due to: * Height of the component and the down-stream spacing. * Chip wave capabilities.
Electronics Forum | Thu Jul 15 00:16:37 EDT 2004 | KEN
bean bags work great, but rarely need to be used. Are you having parts jump out when they hit the laminar, chip wave or both?
Electronics Forum | Fri Apr 06 09:45:08 EDT 2007 | pjc
CSP= Chip Scale Package, meaning small. A MicoBGA is a CSP, while a regular BGA is not a CSP. CSPs require fewer steps to fabricate than standard BGAs. A commonly quoted definition of a CSP is a package where the body size is
Electronics Forum | Wed Oct 09 08:44:05 EDT 2002 | apg
Dear colleagues. I ask you to prompt me about necessity of drawing pastes through a stensil at the soldering micro BGA with step between leeds 1 mm and 0,8 mm or uses only a flux for this purpose. And what most suitable paste for the soldering of su
Electronics Forum | Wed Apr 18 08:14:20 EDT 2007 | davef
Silver palladium termination * AgPd-terminated capacitors are designed for conductive adhesion. Reflow or wave soldering is not recommended. [EPCOS Multilayer ceramic capacitors, Soldering directions, October 2006] * CONDUCTIVE EPOXY BONDING. Epoxy c
Electronics Forum | Thu Aug 20 18:20:21 EDT 2009 | joeherz
Sergey, With that many leads and contact surface area points, it doesn't make sense that the part would move as it has without a gust of wind.... What is your confidence that you don't have an MSD issue on this part. Being that it is a TQFP, it's
