Electronics Forum | Wed Dec 08 11:26:04 EST 2010 | davef
3 Printer Area Conditions * As stated earlier, heat and humidity are damaging to solder paste. Ideally, the printing area should be maintained at 40% - 50% relative humidity and 72°- 80°F (22-26°C). In addition, no air (cool or warm) should blow dire
Electronics Forum | Wed May 30 10:21:10 EDT 2001 | Steve
Rather than meausre the stencil, why not measure it's output. The stencils function is to gage the right amount of solder in the right location. If you are measuring paste volume and you are tracking via SPC, you will begin to see a degradation when
Electronics Forum | Wed May 09 11:05:26 EDT 2001 | davef
IPC-7525 "Stencil Design Guidelines" �9 END OF LIFE, states "Stencils should be inspected periodically for damage that would conribute to decreased printing performance. Refer to Section 7 for inspection guidelines." Or words to that effect. Now b
Electronics Forum | Mon Feb 19 13:49:44 EST 2001 | markkrmp
Bill, It is my understanding that in using the Smart Sonic to clean Adhesives from stencils and mis-printed boards it is recommended to have the system up to a certain heated temperature. What is that recommended temperature? Does this temperature
Electronics Forum | Mon Nov 01 22:16:20 EST 1999 | chartrain
Your problem is common on this solder defect. It is sometimes known as squeeze balls. The formation of these result from excess volumes of paste applied to the pads. Once the paste melts and covers the pad and component termination,the excess has no
Electronics Forum | Wed Oct 12 19:54:03 EDT 2005 | AA
Hi, Thanks for the answers. I have a few others: How often you replace metal squeegees? Do they shorten the life of the stencil?
Electronics Forum | Thu Jun 06 09:45:14 EDT 2002 | Hussman69
We based ours on the type of paste we use (stencil life) and not so much the machine. Then we coupled that to what 'true' conditions we normally see in our plant, and determined that under these conditions Max & min) our printing process should be g
Electronics Forum | Tue Oct 14 11:34:04 EDT 2003 | Axl
As far as solder paste goes search no further! I have worked for some huge CM's as a Process Engineer and a lot of them have put thousands of hours of Engineering time and evaluation just to come up with the same answer every time. For no-clean it is
Electronics Forum | Thu Feb 02 09:06:53 EST 2006 | drewake
Sorry, I am jumping into this late - I'm a new user. Our company is looking to perform an evaluation for a new paste. We are looking at a 63/37 no clean - type 3 or 4. Our technology is currently at 0201s, .4mm pitch ICs & .5mm uBGAs. I have
Electronics Forum | Tue May 08 11:23:11 EDT 2001 | rwilliams
I have been tasked with determining the Life of a Solder Stencil and how to track it. (Basically, how do we know when to replace the stencil, E.g., deterioration of print quality, physical damage, etc.) Obviously there are a lot of variables, but is
