Electronics Forum | Fri Apr 21 23:17:29 EDT 2006 | SD
Well, my first thought is that you need to consider lead-free rework. Depending on the alloy, some stations may not be able to reach the correct temperature. The best stations I have seen have a prism & shows both the pads and the BGA on a single v
Electronics Forum | Mon Sep 21 20:45:55 EDT 2009 | davef
10.4. Pre-Cure Examination. Immediately after material application, the uncured conformal coating shall be examined for: a. Bubbles and Air Entrapments. These defects shall be broken by vacuum, with a sharp probe, or other appropriate tools. b. Bridg
Electronics Forum | Fri Nov 13 08:27:43 EST 2009 | herman
Your customer is very unreasonable to demand void-free BGA SJs. Minor voiding is not a condition for rejection per IPC-A-610D, J-STD-001D, or even J-STD-001DS (Space addendum). Having said that, let me tell you that the voiding has little or nothing
Electronics Forum | Thu Feb 05 02:30:00 EST 2015 | sarason
We were using TL1240Y Tack switches for 2 layered > PCB and posted those switches by hand. Now > planning to re-spin PCA where we recommend that > part to be added on SMT process. So looking for a > better and opt switch with same specs. Please
Electronics Forum | Fri Apr 30 11:03:27 EDT 1999 | Wade Oberle
| | Ok folk's has anyone used Alpha Metal's UP78 solder paste ? | | | | Our place is looking to move to that as the way to go, getting rid of the Hereaus 362's and Alpha 737's of the current set up. | | | | My question's are really : | | how is the
Electronics Forum | Wed Jan 27 09:00:56 EST 1999 | Chris Fontaine
| | I have boards coated with Humiseal 1B73. At a late point mfg. site we need to remove a series of 0603 resistors for optioning purposes. I have been trying to determine the fastest, easiest way to re-coat the pads after removal. Drying time of the
Electronics Forum | Thu Apr 21 19:41:35 EDT 2016 | adamjs
Hi, is there some sort of gas (certainly refrigerated, possibly pressurized?) in which printed boards can be stored to extend the allowed time between SMT paste printing and placement? Or other technique for achieving this? Background: we're a smal
Electronics Forum | Thu Sep 30 15:06:05 EDT 1999 | Dave F
| Guys & Gals, | | I am at present instigating a formal method of recording and tracking any "process" trials that we may wish to run, such as a new paste, different packaged device etc; | | I started with a simple form.....too simple, but now I th
Electronics Forum | Tue Aug 24 15:10:14 EDT 1999 | Ian T
| | | | | Hello everyone, | | | | | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks in ad
Electronics Forum | Wed Aug 25 01:25:49 EDT 1999 | Gyver
| | | | | | Hello everyone, | | | | | | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks i