Electronics Forum | Wed Jul 11 14:48:25 EDT 2007 | rgduval
My boss just received some info through a design mailing list that he's on claiming that FR406 is not RoHS compliant based on the limited number of processing cycles at RoHS compliant temperatures. I would guess that this is related to the relativel
Electronics Forum | Fri Jul 30 09:43:44 EDT 1999 | C.K.
| We are having a process related problem with pullup resistors on a controller card which has a I960 micro-processor. | The controller monitors signal inputs and it's own resources then blinks a LED to indicate its working. The problem is that after
Electronics Forum | Wed Apr 18 08:14:20 EDT 2007 | davef
Silver palladium termination * AgPd-terminated capacitors are designed for conductive adhesion. Reflow or wave soldering is not recommended. [EPCOS Multilayer ceramic capacitors, Soldering directions, October 2006] * CONDUCTIVE EPOXY BONDING. Epoxy c
Electronics Forum | Wed May 14 10:20:37 EDT 2014 | julianf
Hello all! For my mechanical engineering study I want to etch a strain gauge in the Wheatstone bridge configuration in a copper layer of an PCB. The goal is to measure the strain occurring in an PCB even during the press process! We can measure with
Electronics Forum | Tue Jun 18 04:01:07 EDT 2019 | aite
Hi! You can choose low-temperature solder paste. The low-temperature solder paste is tin and antimony with a melting point of 138 °C. When the components of the patch cannot withstand the temperature of 200 ° C and above and the patch reflow process
Electronics Forum | Thu Oct 18 18:39:15 EDT 2001 | davef
Responding to your questions ... RELIABILITY OF 1% SILVER SOLDER PASTE: It�s as good as the next solder paste, all other things the same. Look at your back articles by Jennie Hang in SMT magazine. I want to say she wrote an article on the topic i
Electronics Forum | Sat Jul 16 16:21:56 EDT 2005 | Mark
Should solder paste be placed back in the refrigirator after use? If so, is there a limit on how many times we may take it out and re-refrigirate it? After receiving solder paste, it is put away in the fridge. Then, removed a few hours before use
Electronics Forum | Wed Feb 21 20:01:39 EST 2001 | davef
I�m unclear about the intent of your question, but I�ll take a pass at it regardless. I second the previous poster's commets. [Ya, that's the ticket.] Most chip attach adhesives should not be cured at typical reflow profile temperatures. Check yo
Electronics Forum | Sun May 27 04:18:22 EDT 2007 | grantp
Hi, We are currently soldering only connectors, so there is not that much to do. For the wave we currently use palettes as we solder PCI cards but don't want to wash. So the palette keeps the flux off the board. My reasons for looking at changing o
Electronics Forum | Tue May 14 21:07:03 EDT 2002 | ianchan
Hi mates, Yes, the lighter mass is a valid reasoning. in addition to the "lighter (mass) than thou" point of view, 1) the first reason for mounting active Parts (eg. IC, QFP, LGA...) is to minimize the temperature exposure of the Parts to a single
