Electronics Forum: thermal and monitoring (Page 10 of 17)

Re: Cracking Capacitors and Solder Balls

Electronics Forum | Tue Jun 16 15:00:12 EDT 1998 | Gary Simbulan

There are some common reason for capacitor cracking on my web page if you want to have a look. The document can be downloaded for your reference. | Earl, et al, | Boy things get old and cold around here fast. I promised more detail on my capactior

Re: Cracking Capacitors and Solder Balls

Electronics Forum | Mon Jun 08 15:29:17 EDT 1998 | Gary Simbulan

| Earl, et al, | Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. | First the caps. We stil

Re: Cracking Capacitors and Solder Balls

Electronics Forum | Mon Jun 08 14:52:16 EDT 1998 | Gary Simbulan

| Earl, et al, | Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. | First the caps. We stil

Foam fluxer maintenance, storage and cleaning

Electronics Forum | Sun Nov 08 15:27:25 EST 2015 | davef

Thinner: Flux thinner, NOT paint thinner We kept a spare stone in thinner in inventory. We cut PVC pipe to size, cap in one end, screw thread on the other, stone inside, filled with flux thinner and covered with a screw cap. I don't remember who we

SPM Printer, MIssing side bar to scroll and change values

Electronics Forum | Wed Jul 02 08:07:03 EDT 2008 | realchunks

Try adjusting your monitor - it may be there, just out of view.

Re: Information on 2D and 3D automated optical inspection systems

Electronics Forum | Tue Apr 07 13:49:52 EDT 1998 | Frank Silva

Paul, I work for a supplier of 2D and 3D x-ray inspection systems. If you are interested in discussing alternatives to AOI for post reflow SMT process monitoring and inspection I would be happy to discuss several strategy considerrations with you. W

cap size and copper thickness vs part size questions

Electronics Forum | Mon Nov 14 12:10:05 EST 2005 | davef

Ceramic capacitors larger then EIA size 1812 are known to be very susceptible to thermal shock damage due to their large ceramic mass.

BGA rework: Coplanarity of Xilinx before and after reflow.

Electronics Forum | Tue May 17 08:00:26 EDT 2005 | Bob R.

We went through this with one PBGA supplier recently and they were able to get the problem under control by fixing some of their molding processes that were inducing residual stresses. You can really see it in a thermal moire where you measure warpa

Lead-free and Leaded solder in the same reflow

Electronics Forum | Fri Feb 03 16:40:24 EST 2006 | Mike

At my last employer, we ran a number of tests to make a "Hybrid" profile work (same profile Joe lists) . It worked great for everything but BGAs. The problem (6 months ago) was using parts not rated for lead free reflow temps. As the market fills wit

Re: The care and feeding of adhesive nozzles

Electronics Forum | Mon May 24 13:06:12 EDT 1999 | Deon Nungaray

| | | Any suggestions on how to maintain Adhesive dispensing nozzles??? They seem to plug up over night and it is starting to get on my nerves. We have tried leaving the nozzles in the machine, removing them and soaking in alcohol, blowing them o


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