Electronics Forum | Sat Oct 22 13:37:46 EDT 2016 | greglac
I am currently working on a custom IC where we plan on using Cu pillars at 80um pitch. I'm am trying to narrow down a packaging solution. My requirements are as follows: 40um Line Width/Space Capability (or finer) 4 layers low loss at mm-wave
Electronics Forum | Tue Jun 25 22:22:22 EDT 2019 | proy
We have an electrovert 16" econopak wave solder machine with two identical pots (exchange between Tin Lead and Lead Free). When the pots are exchanged the same thermocouple is used, and the same controller is used - with the set point adjusted. The S
Electronics Forum | Mon Mar 11 07:58:59 EDT 2013 | cyber_wolf
So I have this issue with my 1240. During my weekly oven surveyor check I get a software alarm that says I am out of tolerance. Probe #3 which is closest to the hinge side of the oven is approx. 10 degrees hotter in zone 12 than the other 2 probes o
Electronics Forum | Thu Sep 23 13:37:06 EDT 1999 | Earl Moon
| | | | Hiya, | | | | | | | | Could anyone please suggest recommended manufacturers of | | | | IR rework stations for the removal of various SMT comps. | | | | | | | | Cheers | | | | | | | Why IR ? Ok, I�ve seen only one but that thing burnt the
Electronics Forum | Thu Sep 23 14:18:28 EDT 1999 | Jeff Ferry
| | | | | Hiya, | | | | | | | | | | Could anyone please suggest recommended manufacturers of | | | | | IR rework stations for the removal of various SMT comps. | | | | | | | | | | Cheers | | | | | | | | | Why IR ? Ok, I�ve seen only one but that
Electronics Forum | Thu Sep 23 22:18:50 EDT 1999 | Dave F
snip | | | | | I add my opinion to MoonMan's, hot air is the way to go. We have 3 big systems for BGA rework, 2 from AirVac, 1 from OK Industries. For most other SMT rework needs we use simple hot air systems. We have over a dozen of these small
Electronics Forum | Sat Mar 14 10:16:54 EST 1998 | Clyde F
| | | Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process. | | Hi Craig, | | I have been resear
Electronics Forum | Thu May 23 12:20:08 EDT 2002 | cyber_wolf
Well it depends on what kind of oven you have. If you have a short oven, you are going to have a difficult time. You will probably end up having several different profiles if that is the case. We have 3 BTU TRS 212 furnaces. They are fairly long 8 zo
Electronics Forum | Wed May 07 09:31:28 EDT 2003 | davef
We use uV Dymax glue for thermocouple attach sometimes, but don't like the remainder [anal] and loosing attach, sometimes. Roger Saunders, President Saunders Technology, Inc; said: PRO: � These products are easier to use than high temperature solde
Electronics Forum | Tue Apr 13 13:45:26 EDT 2004 | arcandspark
Ken you say reaching 218 to 221 C will give a homogenus solder ball. The pb free solder balls on the BGA reflow at 235 C to 238 C but I have seen when you combin to differnt types of solder say 63-37 and 10-90 you will atually lower the melting point