Electronics Forum | Thu Jul 22 22:18:12 EDT 2004 | davef
Notes from an AIM No-Lead Presentation ... Wave Soldering * May require a higher pot temperature than tin/lead: 255-265*C * May require a change in liquid fluxes to compensate for the poor wetting of some alloys and high thermal stresses of the wave
Electronics Forum | Mon Oct 19 13:32:06 EDT 1998 | Mark Schwarz
| How are solder pastes manufactured right from the level of extracting lead and tin ? | | | The Tin Institute is good but I rarely find that the raw metals industries guys know about pastes. Making a tin-lead alloy for pastes, as for raw bars, is
Electronics Forum | Fri May 24 07:09:52 EDT 2002 | Andy Hoggan
Teh amount of silver on an immersion silver board won't effect 62/36/2 tin/lead/silver solder, however if the silver on the board is on the thick side and you have a high trace silver content in a 63/37 tin/lead then with the combination of the two y
Electronics Forum | Thu Apr 15 11:15:30 EDT 2004 | patrickbruneel
Pure (red) copper oxide is green, its not a residue its just oxidation. In your case water and heat will accelerate the oxidation process of unplated or unprotected pure copper. The best way to avoid this from happening is use a socket with tin or n
Electronics Forum | Wed Oct 04 13:06:21 EDT 2006 | greg york
Sorry Bert For some reason I'm not getting the Email notifications so appologies never saw the reply. The mettalic antidrossing agent reduces the dross to levels of est. 50% less than compared to 63/37 alloy. When used with SACP/0307 alloy and SACP/
Electronics Forum | Wed May 15 08:33:43 EDT 2013 | emeto
SAC is a lead free alloy that comes from SnAgCu(tin, silver, copper). When you say SAC305 that means 3%Ag 0.5%Cu and the rest is Tin. About the LF I assume that it means Lead Free, but what metal contents it has I can only guess.
Electronics Forum | Tue Feb 01 12:52:19 EST 2005 | jbrower
Hi Tom, I did talk to Bob Gilbert about the sn100c. His comment is that it is a nickle stabalized alloy. Simplisticly, the tin and copper molecules would rather bond with the nickle. He also mentioned that with the SAC alloys, the manufactuers were
Electronics Forum | Fri Dec 21 13:51:16 EST 2007 | howard stevens
Gentlemen, This is an interesting topic. If one refers to the Nihon Superior patent, they make the following claims. "Germanium makes the crystal finer when the alloy solidifies. Germanium appears on a grain boundary, preventing the crystal from b
Electronics Forum | Thu Sep 11 11:34:52 EDT 2008 | patrickbruneel
Interesting observation Manuel. I will be blamed again for crying wolf but look below a lot more defects will soon see the daylight all related to lead-free. This information was posted at the tin whisker forum by Bob Landman of H&L Instruments.
Electronics Forum | Thu Sep 16 20:55:35 EDT 1999 | Dave F
| | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a re
