Electronics Forum: tin whiskers (Page 10 of 13)

Lead Free

Electronics Forum | Thu Feb 05 16:44:19 EST 2009 | stepheniii

I don't think there is any environment where lead free is as good as "real" solder. When you say "high vacuum" do you also mean low gravity? i.e. space? If so my understanding is when the tin whiskers short out the vapour does not settle down but in

NASA-UA report

Electronics Forum | Thu Feb 10 11:29:19 EST 2011 | patrickbruneel

If you search the documents for tin whiskers it’s getting very interesting. Also you can find in the report that lead-free (SAC) solder is used. http://www.nhtsa.gov/staticfiles/nvs/pdf/NASA-UA_report.pdf This report also confirms that the board

Using Sn60/Pb40 on Sn63/Pb37 Rework

Electronics Forum | Tue Sep 13 02:51:35 EDT 2022 | sarason

Lead and tin form a eutectic solution. So no to that one, as to breaking some rule or other other people who are far more knowledgeable than me on "the rules" could pipe in. Also tin/lead eutectics don't grow tin whiskers like a lot of the replacemen

How to prevent defective material from getting to stock?

Electronics Forum | Thu Aug 14 14:01:03 EDT 2003 | Andrea

I was recently given a copy of the "Tin Whisker Agency Action Notice" I was then asked to recommend and implement a action to prevent the suseptible components from reaching our stockroom. Since I can not commit my personel to activly research which

Solder briding on QFP

Electronics Forum | Sun Apr 04 00:51:01 EDT 2010 | jmelson

On the Xilinx chips, I am pretty sure these hairs are NOT tin whiskers. The solder in this particular build was SnPb, and pure tin would almost certainly melt at soldering iron temperatures. My theory is that slivers of the lead frame material, lik

lead free pcb plating?

Electronics Forum | Sat Jul 28 08:37:52 EDT 2007 | davef

There is no good choice. Board Finishes: Industrial/Battelle Class 3 Environment [Reliability Knowledge Gaps: For use of Pb-free solders in High Reliability Applications, J Smetana, iNEMI Availability of SnPb-Compatible BGAs Workshop, March 1, 2007,

Tin

Electronics Forum | Wed Dec 21 21:24:59 EST 2005 | davef

Primary differences between Matte Tin plating and Bright Tin plating are: * Temperature compatibility ** Matte Tin is compatible with the elevated temperatures of lead-free, reflow processing (250-260C). ** Bright Tin has a tendency to discolor (turn

Lead Free

Electronics Forum | Tue Feb 03 21:36:29 EST 2009 | davef

NASA gets itself in a froth about the potental for whisker growth in high tin solders used in space applications.

Pure Tin Quandry

Electronics Forum | Fri Jun 03 16:52:48 EDT 2005 | davef

Your customer is being smart. When we look at the evaluation that some component suppliers do in assessing the potential of the pure tin solderability protection they've chosen to produce tin whiskers, we just shake our heads. Essentally they say,

Black pad defect

Electronics Forum | Wed Feb 12 17:41:18 EST 2003 | MA/NY DDave

Hi, Gee David F is as bad or as good as me on a bad day. Boy can I get mad... "new information" Many of these defects have been around so dang long and seem to get recycled as the latest rage and the newest of new information in technical articles


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