Electronics Forum | Tue Oct 02 15:33:28 EDT 2007 | shrek
So, a test probe from ICT will not make solder rust?
Electronics Forum | Tue Oct 09 14:10:52 EDT 2007 | hussman
What do you mean by "what do you mean"? I was just making fun. But if you want, you can take it the wrong way and blame me for everything.
Electronics Forum | Wed Oct 10 07:54:50 EDT 2007 | shrek
Hussman,I'm quite happy to exist alone in his swamp and dine on delicacies like pickled eyeballs. This means you, me lad. BACK OFF!
Electronics Forum | Wed Oct 10 08:51:29 EDT 2007 | wavemasterlarry
LISTEN our old Soltec never rusted so i don't know where all this nonsense with rust is going. Mika, how about that gobblett we were supposed to have together? ;-)
Electronics Forum | Mon May 19 08:18:22 EDT 2008 | davef
You should set the temperature at liquidus point of the solder used on the BGA plus 20 to 25*C. So, for tin-lead that would be ~215*C. Most lead-free solders run about ~20 to 25*C higher than that.
Electronics Forum | Tue Sep 02 22:21:26 EDT 2008 | davef
IPC-6012 Table 3-2. States "Fused tin-lead or solder coat - Coverage and Solderable". The lack of any specific dimension criteria doesn't make this any less a requirement. There must be complete coverage of solder on the land, and it must be wettable
Electronics Forum | Tue Oct 05 15:20:45 EDT 2010 | scottp
I agree that in consumer electronics there may be nothing wrong with using a lead free BGA in a SnPb process, but that blanket statement can't be made for the high reliability market.
Electronics Forum | Wed Oct 06 12:45:01 EDT 2010 | blnorman
I've seen studies were Pb-free BGAs in a leaded process have no reliability issues when a lead free profile is used. Pb-free profile ensure proper ball collapse and solder joint formation.
Electronics Forum | Wed Oct 27 19:54:54 EDT 2010 | sai
We have two MY100sx. This is a good machine. User friendly. Get the Heller 1809, 9 zone. That will be good for tin lead and lead free process.
Electronics Forum | Thu Nov 04 07:51:41 EDT 2010 | leemeyer
I am in need of a 250 gram jar of Indium Corporation solder paste #81800. This is a tin lead alloy 63/37 with type WMA-SMQ62 water soluable flux. If anyone has an extra jar that is not past it's expiration date please contact me.
