Electronics Forum | Sat Feb 22 11:27:16 EST 2003 | stefwitt
In the early days of SMT we were using vibratory bulk feeders for chip components. It was quite obvious that some of the components had to try several times getting through the gravity trap or with the right side up through the light sensor. As a res
Electronics Forum | Fri Mar 05 19:17:00 EST 2004 | Ken
I have had OSHA strap accumulative "sniffers" onto wave operators and maint. tech's. THe sniffers collect air bound particulates and trap them into a filter. Later the filter is analyzed and an operator exposure rate is determined. They also will la
Electronics Forum | Tue May 25 10:16:03 EDT 2004 | Bimal Patel
We are doing assemblies using Immersion Silver coating for RF assembly for a while now. We did not have problem using 63/37 SN/PB solder paste untill recently. We started seeing black marks on the finish and around the solder joint recently. We have
Electronics Forum | Tue May 25 10:16:07 EDT 2004 | Bimal Patel
We are doing assemblies using Immersion Silver coating for RF assembly for a while now. We did not have problem using 63/37 SN/PB solder paste untill recently. We started seeing black marks on the finish and around the solder joint recently. We have
Electronics Forum | Tue Jun 01 06:13:11 EDT 2004 | abraham
We have been populating lot of BGA boards and for all these boards we have been using No clean solderpaste. We are under the impression that aqueous cleaning is not recommended for BGA boards as the residue cannot be cleaned properly. However we are
Electronics Forum | Wed Sep 08 10:32:39 EDT 2004 | C Lampron
Good Day Everyone, I have a Class 3 medical customer where we are seeing solder balls adjacent to the fine pitch device leads post reflow. We are processing these with OA so small amounts of solder balls usually wash of at clean. These however, are
Electronics Forum | Sun Jan 09 19:37:15 EST 2005 | Bob R.
I'm just thinking out loud here with no experience to back it up, but I could see where you're trapping air or solvent filled voids inside the via by tenting from both sides. When you go through a heat cycle like reflow or wave solder you could be e
Electronics Forum | Fri Feb 18 09:06:33 EST 2005 | russ
This is what we use. 1. we only reball when we experience a manufacturing defect (short, trapped component, etc...)and if the part is expensive 2. No testing is done prior since we only reball parts that have a defective attachment. 4. The reliabi
Electronics Forum | Mon Mar 21 08:57:29 EST 2005 | davef
Se�or Tech Possibilities are: * The vent on the drain line is blocked. Generally when this happens, the blockage, like come critter building a nest in the pipe, is found on the roof. In this case, the smell would be constant. * Somewhere, the drai
Electronics Forum | Wed Feb 01 11:47:07 EST 2006 | Mike
James, If you have a true MSD issue, then baking them AFTER your reflow is not going to fix the issue. I would have to agree with GS and look at trapped cleaner media (if your not No-clean) under the components, or inside connectors. If your runnin
