Electronics Forum: types of bridges (Page 10 of 50)

Next Stages of Lead Free

Electronics Forum | Tue Aug 15 15:39:15 EDT 2006 | samir

Mounds of data were provided supporting a SnAgBi system. The data showed that this type of alloy had performed the best under ESS and reliability testing - as long as the Bi content was kept

Reduction of solder paste usage

Electronics Forum | Wed Mar 14 11:24:32 EDT 2007 | Scotceltic

Have you thought about switching to either automatic paste dispensers or rhemoetric pumpheads in order to contain the paste and only dispense what is needed during your shift ? I am not sure what type of printers you have, but I know both of these o

Soldering Strength of 0603 Component

Electronics Forum | Tue Oct 05 03:24:08 EDT 2010 | mskler

This breaks the soldering not the body of the part. It breaks 90 degree from the length of teh componet.Is there any diffrence if I will use the solder paste of the type 4 for the 0603 componet.

Soldering Strength of 0603 Component

Electronics Forum | Wed Sep 29 09:35:39 EDT 2010 | blnorman

Can any body help me that how can I check the > strength of the 0603 capacitor & how much it > should be? Is there any standard for the > soldering strength of the Diffrent SMT > packages. Manjeet singh I'm not aware of a standard that provides

Silver Sulphide Contamination of Resistors

Electronics Forum | Wed Feb 21 21:21:05 EST 2001 | Dave E

Realistically it seems like a component problem that the vendor is trying to blame on our processes. The problem is internal to the 0805 resistors so I suppose they are perhaps porous to some degree. I have only heard 3rd hand about the analysis that

Acqueous Cleaning of RMA Flux

Electronics Forum | Wed Sep 10 11:30:38 EDT 2003 | bwet

We are interested in hooking up a batch acqueous cleaning system in CHICAGOLAND area (for cleaning RMA flux). Can somebody recommend an EPA contact? What type of regulatory requiremetns would there be? What agency should we seek out before we instal

Question of delamination in PCB

Electronics Forum | Fri May 01 07:22:56 EDT 2009 | kareal

In my project of flip chip PGA production , I found serious delamination in interface of solder mask and first layer copper trace of substrate after UHAST 96hrs( 130C, 85%RH) reliability test. The delamination are always around one type solder bump,

what is the cause of humming/vibration of a ballast x'former

Electronics Forum | Thu Mar 02 13:13:14 EST 2006 | Chunks

A ballast is the device needed to energize fluorescent lamps during operation. In all fluorescent lighting systems, the ballast provides the proper voltage to start the lamp and then regulates the electric current flowing through the lamp to stabiliz

Re: Wavesoldering of PLCC44 package

Electronics Forum | Fri Feb 25 11:13:32 EST 2000 | Russ

This probably won't help much but I find it at least a little interesting. During some experimentation recently I accidently loaded a board into the wave upside down and it had a PLCC 68 package along with other types of components that had only bee

Standard Format of component description

Electronics Forum | Thu Mar 16 10:28:34 EST 2000 | Ashok Dhawan

I am looking for a general guidelines on a standard format of component description. Being contract manufacturer , we do come across various components from various customers. Everybody is different , one way or other. That create a lot more prob


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