Electronics Forum | Mon May 22 15:46:49 EDT 2006 | adlsmt
Grant has a good idea, we started that way also. We made a tank out of stainless steel with copper tube coils about 18" off the bottom. Circulate cold water through the tubes to condense the vapor to keep the loss down. We used electric burners under
Electronics Forum | Mon Aug 21 04:36:34 EDT 2006 | Rob
Yes, appropriate storage & component handling proceedures should be followed depending on the MSL (Moisture Sensitivity Level) class of the component. Some component suppliers are now marking the MSL class on the label, along with PBT (Peak Body
Electronics Forum | Tue Nov 16 13:00:20 EST 2010 | Shean Dalton
ASSCON offers a range of Vapor phase reflow soldering systems. Available in benchtop, batch, inline, vacuum inline. The US distributor for ASSCON is ATEK at http://www.atekllc.com/html/vapor_phase_.html The ASSCON website: http://www.asscon.de/e
Electronics Forum | Mon Jun 07 17:36:19 EDT 2010 | vmorina
Greetings SMT folks, My name is Danny, I am looking to purchase a low-medium/prototype reflow soldering machine. I would like to have your opinions for which vendor I should go for and model. I have been looking at the convection heating reflow sold
Electronics Forum | Fri Jun 03 04:16:27 EDT 2005 | Bryan She
Background: We use a thermal boards to setup/profiling the reflow oven for pilot run.and then daily verify the reflow profile with this thermal board.Now we phased into LF production,and the LF thermal board can only withstand 25~30 times reflow excu
Electronics Forum | Fri May 07 23:43:10 EDT 2010 | jlawson
I assume you using a fixed mass vapour phase system? Yes rates of rise are impacted by the mass of the PCB, larger the mass to mass of vapour phase the lower the rise generally. So if you load the machine with very little mass PCB rise times can be
Electronics Forum | Wed Dec 10 14:03:56 EST 1997 | Scott Cook
| I would appreciate hearing views on vapour phase soldering particularly in respect to BGA's. | I know that they used to use CFC's but apparently this is no longer the case? | Can anyone help with some info? | Thanks, Alan Brewin Alan, Unfortunately
Electronics Forum | Fri May 14 15:03:19 EDT 1999 | lima
| | Does anyone know of any industry guidelines for the exhausting of volatiles in reflow ovens? I've seen some numbers like 1,000ppm for the oven atmosphere, but is this typical? | | | | My concern is the volatiles in my WS629 solder paste may be
Electronics Forum | Wed May 12 17:54:22 EDT 2010 | jlawson
Just a note, on fixed galden machines yes the way they compensate for rise time is as the previous post suggested, change power and also stage the lowering of the PCB into the vapor cushion ie not the main one but further up in the tank. The disadvan
Electronics Forum | Thu Jan 18 21:52:24 EST 2001 | arul2000
>>>>Dave, The BGA substrate surface finish is NiAu, while the PCBA pad surface is HASL. The solder ball composition is SnPb 63/37 and the solder paste used on the PCBA is also the same but with 2% Silver.>>> Dave, sorry I don't have the picture with
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