Electronics Forum | Mon Mar 07 10:14:31 EST 2005 | jmedernach
Cellular and PDA architectures employ this technology all the time. You have to be careful with your board supplier as well as with your plugging approach. Leave the via unplugged, I guarantee voids in the solder joint. That leaves us with, "how d
Electronics Forum | Wed Mar 25 16:36:10 EST 1998 | Steve Joy
We have successfully put .016" vias in .030" pads. There is no drain off with .030" solder balls, since the actual volume in the .002" depression is low. We did notice random bubbles where, apparently, the solder reflowed and trapped the air in the
Electronics Forum | Thu Jun 15 14:14:18 EDT 2017 | pfuhrman
I have seen a few references in this forum to an old study (1980s?) by Roger Wild at IBM. But I cannot find a published report or usable reference to one. davef mentioned the SMTnet archives as a possible source, but that has also been a dead end.
Electronics Forum | Mon Jan 18 20:51:29 EST 1999 | Dave F
| Can anyone recommend ways of reducing damage to solder masks ... a new wick perhaps. I find that using standard wicks the imposed damage is un-acceptable. | | Also any good links on the subject of bga rework would be really appreciated | | in ear
Electronics Forum | Mon Jul 26 18:01:30 EDT 1999 | Earl Moon
| Presently protos of micro-bgas (80i/o) pitch .030/.031 | 12BGA per assembly | | The board is a (.062, 4 layers) FR-4 using Dry film | Pads .014inch | Vias within footprint .020inch | Vias to be filled by bottom side(solder side) only .030in dia. F
Electronics Forum | Mon Jul 26 18:05:18 EDT 1999 | ScottM
| Presently protos of micro-bgas (80i/o) pitch .030/.031 | 12BGA per assembly | | The board is a (.062, 4 layers) FR-4 using Dry film | Pads .014inch | Vias within footprint .020inch | Vias to be filled by bottom side(solder side) only .030in dia. F
Electronics Forum | Fri May 15 18:18:51 EDT 1998 | Earl Moon
| Help! | We have been doing some trials on Paste Through Hole and have encountered a problem. The screen is designed (as is suggested in technical info re PTH) to give double the paste volume required to fill the void between the pin and via. The
Electronics Forum | Tue Jul 31 17:11:28 EDT 2007 | rpadilla
Is the via hole not supposed to be there, or is this by design? If you are trying to fill the via hole with solder and not have voiding issues, I suggest using a type 4 solder powder mesh size. Reason being, anytime you go beyond Type 4 mesh, to so
Electronics Forum | Mon Feb 12 21:38:38 EST 2007 | DEK Answer Guy (PR Dept)
Technical Papers) -ProFlow� upgrades (MPU's). -Paste Low Optimisation -Adjustment of the Print Carriage to ensure Squareness to the Stencil -Replacement of Hinge Pin Assembly -Conversion of ProFlow� to Horizontal Mount -ProFlow� Guides for Operators
Electronics Forum | Sat Nov 10 23:46:36 EST 2007 | mika
BTW, The surrounded QFN fine pitch terminals should have the normal aperture reduction of 7 % in case of RoHS Senju solder paste. This works for our Telecom customer. The vias in the ground pad will be somewhat filled with solder and makes it diffi
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