Electronics Forum | Tue Jul 03 22:18:33 EDT 2001 | davef
Assuming that you are talking about voids in solder connections: * Consider voids on the surface of your solder connection a defect. * Consider voids that you can't see to be a process indicator. See A-610C, 12.4.8 for authoritative guidance.
Electronics Forum | Fri Aug 06 10:27:05 EDT 1999 | Kenneth Hedman
| | I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? | | | | Thank you, |
Electronics Forum | Sun Oct 11 13:53:26 EDT 1998 | Vincenzo Longobardo
I have datas to substain that a not wetting PCB ( the HAL oxided or not uniform in thickness )if soldered in reflow, it shows voids with X-Ray inspection.The voids are in side all the joints not only on the solder pads levell. Is there a technical d
Electronics Forum | Wed Aug 22 20:18:17 EDT 2001 | mcox
I can send you a DOE I did on WS vs NC on BGA�s, but the results were.. NC = Had significantly less voiding both in number of voids and size of voids. A longer soak time (reflow oven) resulted in less voiding both for NC and WS. Mike
Electronics Forum | Wed Nov 21 10:41:03 EST 2001 | arzu
Hello, Sometimes you have no choice other than putting uvias in ubga's-pads. I know examples of high-end mass production of products with ubgas having voids. (no problems, but always voids visable in x-ray) I also performed a DOE a while ago to avoid
Electronics Forum | Wed Apr 16 11:20:31 EDT 2003 | russ
What was the original complaint? when you say solder wicked onto top of capacitor do you mean it was dewetted from the board and only on the cap? What type of device showed voiding? how bad was it 20%,50%? I have found that the paste type seems to
Electronics Forum | Tue Mar 09 22:13:20 EST 2004 | Ken
What x-ray system are you using? Check out Dage. I bet you have voids...just can't image them. Why the fuss over voids? Voids terminate the crack propegation and can extend the time to failure for creep fatigue. I would not be concerned unless yo
Electronics Forum | Mon Jun 07 21:26:03 EDT 2004 | davef
First, voiding is a process indicator. Next, as you say, the profile is a significant contributor to void formation. Finally, when considering the "material factors" that drive void formation, solder paste formulation is the most critical. Discuss
Electronics Forum | Fri May 15 10:04:59 EDT 2009 | aj
Hi all, Is there any standard for percentage voiding on the center thermal pad on a QFN? We use the dot matrix array for paste to allow for outgassing etc, but we have had a couple of xray inspection "fails" for voiding on this pad , in or around 3
Electronics Forum | Thu Oct 11 13:10:04 EDT 2012 | anvil1021
We are experimenting with void control in reflow and have had pretty good luck for the most part in attaining Class lll IPC spec. but we have seen a sudden increase in voiding on a specific product and I was wondering if anyone has seen this extreme
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