Electronics Forum | Thu Apr 07 14:07:11 EDT 2005 | Tater
Both methods are fine, but you should create or use a spec that fits your process needs. You should also consider if this warp will directly impact the performance of your final product once it's completely built. Then make sure your customer won't
Electronics Forum | Sun Apr 10 06:27:50 EDT 2005 | WarpSpeed
1.) First of all: What is Your customers requirements??? 2.) If the customer or You don't have a specification; I will strongly recommend that you follow the "IPC-IPC-TM-650 Method 2.4.22 Bow & Twist" that [DaveF] suggested. 3.) If You have "critic
Electronics Forum | Tue Mar 31 12:43:52 EDT 2009 | dallascap
I don't think there is anything releated to IR light in your false calls rate rise on Post-reflow. Soldering Flux is most probably the reason. Indeed, more or less soldering flux residue condenses on the boards according to the oven extraction syst
Electronics Forum | Wed Jan 29 08:32:48 EST 2020 | dontfeedphils
I'm currently running Grid-Lok in my printer and have used it almost exclusively in the past. That being said, I'm looking for a solution to help correct/remove sag and warpage on PCBs that will run through our TRI SPI and AOI. I have no doubt th
Electronics Forum | Wed Nov 01 08:02:16 EST 2000 | Wolfgang Busko
Massimo: Do you encounter or see warpage of the device or the PCB, I think I remember that there was a thread about this topic of shorts of the corner pins of BGA. You might try the archive. Wolfgang
Electronics Forum | Fri Nov 12 17:58:18 EST 1999 | Jason Nipper
I have been actively experimenting with Selective WS pallets fabricated from Delmat. I need feedback from users on life expectancy, demesion constraints relative to warpage or degradation, and any useful info on ways to maximize life and prevention
Electronics Forum | Tue Jun 23 17:24:22 EDT 1998 | Ken Chase
Contact New Era Technology, Inc. @ (603)669-7971 for custom pallets and titanium stiffiners and masking.
Electronics Forum | Fri Sep 14 01:43:36 EDT 2001 | dhanashekar
please check the following also. in one of the cases we came across the second point was the problem. 1. the parallelisum of the conveyor. 2. the warpage of the board. 3. the stencil.(the differential height in the paste deposition of the two pads
Electronics Forum | Wed Dec 19 09:23:47 EST 2001 | davef
Bow & twist for bare boards and panels: IPC-A-610 1.5% for PTH only and 0.75% for SMT
Electronics Forum | Wed Dec 04 04:29:51 EST 2002 | CH
U might need to run the board on a reflow pallet with a clamper. This will help to solve the warpage problem on the PCB and connector.
