Electronics Forum | Sat Mar 08 21:45:59 EST 2003 | MA/NY DDave
Hi The other thing the Ni does is to create a time barrier for the underlying copper (Cu) migration into the joint. Degradation still occurs yet it is slowed significantly. Diffusion Equations under, electonic current pressures across time, are inv
Electronics Forum | Mon Mar 10 15:20:41 EST 2003 | MA/NY DDave
Hi Well I don't have all the titles right handy, yet let me give a few places for you to check. All my books aren't exactly at my finger tips. Author: Tumalla (??spelling) He is now at Georgia Tech Author: Lasky, Seraphim Author: Ning-Cheng Lee or
Electronics Forum | Wed Mar 12 16:04:24 EST 2003 | O' Connor
Everybody thanks for all your help, the problem has been solved. Before I describe the solution I've got to own up, I'm the PCB Design Eng., The Process Eng. lobbed this problem onto my desk last week, said the problem lay with the PCB finish, whats
Electronics Forum | Tue Mar 11 13:42:07 EST 2003 | MA/NY DDave
Hi As I got thinking about your problem, as you stated it, I am wondering if maybe we have some oxides or too thin of a Gold Immersion layer so that some of the underlying NI is being oxidized. The colorization that you described is what intriques m
Electronics Forum | Wed Mar 12 17:53:52 EST 2003 | davef
O' Connor Haaa. It's usually the design guys that foist the problems onto my desk. Now that is one shrewd process type that you have working at your company!!!! Can I have his / her name and number to get some tips on the technique that he / she
Electronics Forum | Thu Mar 06 11:36:37 EST 2003 | O' Connor
Hi, I'm experiencing a problem on a standard part made many times before -Ni/Au finish PCB, Reflow 100% SMD parts. After reflow the gold on the pads does not fully fuse with the solder paste it remains intact on the extremities of the pads, it seems
Electronics Forum | Fri Mar 07 05:36:21 EST 2003 | O' Connor
Hi Again, In answer to DaveF - Yes solder is fine where the solder paste is deposited , but the part of the pad visible after pasting is still visible after reflow. Previously the solder paste & all the gold diffused & flowed giving a complete silve
Electronics Forum | Sat Mar 08 21:31:17 EST 2003 | MA/NY DDave
Hi Yes DavidF I agree, and that is what I think I am reading in the orginal and follow on post from the poster. I think this problem is just below full failure to solder which was your point, I think. You, and I particularly, are taking opposing y
Electronics Forum | Thu Mar 06 11:50:22 EST 2003 | John O'Donnell
Greetings Sir, Although I am not qualified to address the issue in detail, I do know first hand that you can obtain very comprehensive and accurate solutions and explanations from George Westby, Director, Universal Instruments Advanced Technology and
Electronics Forum | Tue Mar 11 13:35:04 EST 2003 | MA/NY DDave
Hey Neat, We share some of the same books, although I would strongly recommend he expand his collection. That Flex book is only one, the most pricey one, of many on that technology. JUST Kidding THANKS!! If we started listing all our magazine, te
