Electronics Forum: wetting standard (Page 10 of 15)

How to choose a new solder paste

Electronics Forum | Thu May 26 16:41:00 EDT 2011 | scottp

Here's what I do: - Test Surface Insulation Resistance (we're in the high reliability market and use a test significantly harder than IPC's). I also test SIR in combination with other assembly materials like conformal coatings and wave solder flux

Re: Qualifying new PWB Vendors

Electronics Forum | Fri Jan 15 15:17:21 EST 1999 | Earl Moon

| | Hello, | | | | We are qualifying new sources of PWB vendors. We've got the first lot of "produciton" boards in and we want to put them through the paces before turing the vendors on. | | | | So far, the tests I can think of performing, and tha

Re: Soldering on a Ground Plane

Electronics Forum | Fri Feb 11 10:14:54 EST 2000 | C.K.

Dave, to answer your questions, point-by-point: � Just out of curiosity, how are second side, skippy components oriented on the board with respect to the wave? The SMD's are all oriented in the "correct" direction with respect to wave direction(i

PCMCIA QFP Process Issue

Electronics Forum | Sun May 21 05:54:04 EDT 2000 | Sal

Currently manufacturing double-sided PCMCIA cards with a nickel/gold finish, which are 0.0235thou in thickness, using surface mount carriers. Problem we are seeing is when building the densely populated side on the second pass we are seeing lifting o

PCB Trouble shooting Lab

Electronics Forum | Tue Apr 17 09:38:04 EDT 2001 | CAL

With some help from our good Friends at Agilent Technologies our RF Lab includes testing up to 100GHz. Equipment includes Vector network analyzer, signal analyzer, dual channel power meter, noise filter meter, advanced impedance analyzer (including

Wet behind the ears

Electronics Forum | Sat Apr 28 11:55:39 EDT 2001 | kaoni

Well, I hope I don't offend anyone. I'm brand new to this. I am considering starting my own assembly line to handle my own products but would like to be able to utilize my downtime as an opportunity to keep the machines running by trying to pick up a

Re: Paste Push-Out In PP Assembly

Electronics Forum | Thu Jul 20 12:49:05 EDT 2000 | Bob Willis

So far on all my trials on PIHR I have only used standard products as the paste is defined by the printing requirements for fine pitch etc. As most people will have seen you just get a heap more residues with this process and even more with lead free

Re: Second wave elimination

Electronics Forum | Sat Feb 05 09:13:39 EST 2000 | Dave F

Hany: In response to your questions: 1- In a double wave solder M/C, is possible to completely eliminate the second wave without affecting the quality of the solder joints? Many w/s machines have a turbulent wave and a smooth wave. The turbule

Touch up on 0603 Chips ( Ceramic caps)

Electronics Forum | Mon Jan 31 14:08:26 EST 2000 | Ashok Dhawan

I have got a number of assemblies back from a customer with feedback that the solder fillet is less than 25% of chip height per IPC-Standard-610B Class 2. Most of my joints are having good wetting but fillet height does not meet min ht requirement of

Re: Bare Copper Circuit Boards

Electronics Forum | Fri Jun 18 20:09:52 EDT 1999 | Dean

| Has there anyone bold enough to try this in their shops? My cubemate just got through telling me that at his last shop, they had bare copper boards (no HASL, no OSP, no nothing), with minimal solderability problems. | yes, 8 years ago I developed


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