Electronics Forum | Thu Sep 04 10:42:29 EDT 2008 | vladig
You are right. That is what process engineers are for. HOWEVER, in many cases they just can not fix a problem because it either in the part, or board or paste and so on. I used ot work for a large company in QA doing lab work for production. In many
Electronics Forum | Fri Aug 29 10:23:30 EDT 2008 | vladig
Everyone has been playing a guess game so far :-) but we don't even know what the lead finish is:-) Even old (Sn-Pb finish) days, the ammount of Pb in the plating would be on a single digit level (just to mitigate Sn-whiskers growth), meaning that th
Electronics Forum | Wed Sep 10 14:39:30 EDT 2008 | vladig
No, we didn't do the test you mentioned, but did EDS on the joints and didn't see carbon their (which would indicate the presence of any organic-based contaminant). For the customer the issue was closed and passed to the board shop. We did work with
Electronics Forum | Thu Sep 04 09:18:10 EDT 2008 | realchunks
In the REAL world most people don't have time to send out problem boards and wait for someone else to do their work. In the real world most of these problems on this forum are caused by someone doing something dumb, or a change was made that the pos
Electronics Forum | Thu Apr 15 10:05:50 EDT 2010 | dwonch
Hi all, Long story ahead.... We are having issues with board vendors on some of our higher layer count (thick) boards. Specifically under BGAs with high aspect ratio vias (14:1). We are using ENIG finish and a lead free process. Basically we get t
Electronics Forum | Tue Jul 19 14:29:12 EDT 2005 | ppwlee
What are possible failure analysis (destructive or non-destructive and what are the pro/cons) I could conduct on the component level (of an IC) to determine failure mode/root cause? We are measuring internal shorts between leads on a SOIC after sold
Electronics Forum | Tue Sep 25 23:09:23 EDT 2018 | franknguyen
Hi, We are PCBA production company which factory's located in Vietnam. Somtime, we have to analyse failure of product to find out the root cause (ex: Micro-crack of solder joint under BGA IC...). We are searching labs around Asia (Vietnam, Malaysia,
Electronics Forum | Fri Oct 29 05:23:00 EDT 1999 | Wolfgang Busko
Hi Bart, that�s much to high. If that would happen to me my boss would tear my head off. For improving the yields you must find the cause for the soldering problems. What are the symptoms? What could be the cause for the symptoms? Could be design pr
Electronics Forum | Thu Apr 03 09:27:04 EST 2003 | davef
First, welcome to SMTnet. On your question, are you talking about control charts? If so, here's some background on control charts http://deming.eng.clemson.edu/pub/tutorials/qctools/ccmain1.htm What are you plotting: * Independant variables? * De
Electronics Forum | Wed May 02 06:28:26 EDT 2007 | LC
In our first run, we actually followed the solder paste recommended profile then we were told to use the BGA recommended one. When we had the 2nd run we still got the same problem. We're using Kester 909HPS (lead free) and ENIG boards. Thanks.
