Electronics Forum: x-ray and machine and do's (Page 10 of 42)

Mydata Pick and place

Electronics Forum | Thu May 24 09:11:12 EDT 2001 | Grant Petty

Hi, I would agree. We purchased a TP9 just the slow machine, but we were a small company at the time, and it worked fantastic. Almost no maintenance, and it's a dream to changeover. The serivce in Australia is also very good, but that does not appl

COB and wire bond

Electronics Forum | Mon May 07 15:13:03 EDT 2001 | jdtpfacreate

Singh, The equipment varies in price. We make a wire bonder called the HW27U-H Wire Bonder. This is a gold to gold wire ball bonder. The substrate size you mention is within the area we can take into the machine. The key is the bonding area.

Inspection and splicing

Electronics Forum | Tue Aug 21 08:34:03 EDT 2007 | rgduval

We have the same problems with cut/tape parts. But, we specialize in short-run prototypes, so I don't have much of a choice but to deal with it, and find a way to make it as easy as possible. We just demo'd a splice tool from Sierra Electronics (ww

Circuit cam and mydata

Electronics Forum | Fri Apr 10 09:59:13 EDT 2020 | spoiltforchoice

&gt; We unfortunately use GERBER data to digitize <BR> &gt; boards more than any CAD. We are CM and many of <BR> &gt; our customers do not provide CAD. With some <BR> &gt; Legacy products, we still use 274-D Gerbers

SMT Processing and gasketing

Electronics Forum | Tue Nov 11 17:35:08 EST 2008 | davef

SM-840, is a material qualification document only, with all the test requirements applicable only to a defined test coupon, not to production boards. So, it's useless for what you're trying to accomplish. As assemblers use A-610 - Acceptability Of E

AOI, Quality and SPC

Electronics Forum | Mon Mar 03 13:18:02 EST 2003 | msivigny

Hello phil, The use of AOI systems give us the opportunity to auto-collect defect information much the way you're using them now. AOI systems become extremely effective when the collected data is used to perform some positive change into the process.

Re: MoonMan and Tetras

Electronics Forum | Tue Apr 27 05:26:14 EDT 1999 | Charles Stringer

| | Hey MoonMan, | | | | Did I catch in one of your fabulous threads that you're using Tetra stencils? I'm anxious to find out how you're liking them. | | | | We we're all set up to go to Tetras, then mgt decided to close down our factory - Dooop!

Re: MoonMan and Tetras

Electronics Forum | Tue Apr 27 09:26:43 EDT 1999 | Chrys Shea

| | | Hey MoonMan, | | | | | | Did I catch in one of your fabulous threads that you're using Tetra stencils? I'm anxious to find out how you're liking them. | | | | | | We we're all set up to go to Tetras, then mgt decided to close down our factor

BGA's and the Fuji IP2

Electronics Forum | Sun Jul 14 05:37:17 EDT 2002 | johnw

Hi all bga placcement on an ip2 can is possible although as pointed out the x/y dimensionsof the part are used for placement I would suggest you arrange for your parts to be taped and reeled as this is the prefered way to go what size are the bga,s

ICT and specifying PCBA testing

Electronics Forum | Mon Mar 29 12:10:14 EDT 2010 | rway

Test Jet will work for catching lifted leads, certainly. X-ray is the only thing for testing for internal solder defects such as voids and cracks. I personally do not have any experience using X-ray, so I cannot advise on its reliability. Perhaps


x-ray and machine and do's searches for Companies, Equipment, Machines, Suppliers & Information

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Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
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