Electronics Forum: pass (Page 95 of 142)

BGA failure after coating

Electronics Forum | Thu Oct 01 07:03:55 EDT 2009 | davef

We doubt that Humiseal 1A33 is causing opens in your assemblies. We'd guess the opens occur earlier in the process, but are not hard failures. So, you pass your tests. When applied, the conformal coat flows into the gap in the ball crack and insulate

defects in pcb manufacturing

Electronics Forum | Sun Nov 01 23:51:44 EST 2009 | boardhouse

Hi Julie, My opinion is that the top board would not pass IPC, solder mask encroachment on pads. Second board is what we call Orange peel,this can be caused two way's. 1) the solder mask was not tack dried enough prior to imaging which caused artwo

SN96 solderability on electrolytic tin

Electronics Forum | Thu Nov 19 13:49:00 EST 2009 | bricke

We have been manufacturing a part using bright electrolytic tin as the finish. Our customer has been hand soldering using 63/37. They have recently switched to SN96 and have been experiencing solderability issues. We have sent samples to an outside

Pin hole

Electronics Forum | Thu Mar 11 02:56:01 EST 2010 | grahamcooper22

Hi, blow holes / pin holes / holes in joints are usually a sign that there is excess moisture somewhere around the solder joint. Moisture can be in pcbs / components, so try drying them....a simple thing to do is pass a bare pcb throught your reflow

BGA Placement Process

Electronics Forum | Wed Mar 31 09:44:12 EDT 2010 | bandjwet

One thing I would suggest right off the top is to go to a paste printing process. This will get first pass yields higher (usually 10+% higher than gel flux). If you are suggesting that you have good collapse everywhere, the profile is adequate (soun

solder joint crack in post thermal cycling test at Dye & Pry

Electronics Forum | Sun Apr 11 11:39:52 EDT 2010 | manchella

When we have sent some of motherboards for reliability testing in a tird party laoratory. It is found that when Dye&Pry is done after 600 cycles of Thermal Cycling, in LGA socket only one of the corner solder joing had 100% type 3 crack. All other so

QFN voiding levels

Electronics Forum | Thu Jun 10 16:42:11 EDT 2010 | daxman

Hi Muarty, We've had a lot of experience with QFN's now. Several years ago we started testing various design methods of the via arrays as well as paste apertures to cover the arrays. There has been some time that has passed now since these packages

Solder Balls-No Clean Paste

Electronics Forum | Thu Aug 19 05:19:31 EDT 2010 | grahamcooper22

I have seen that moisture in pcbs will cause mid chip solder balls. To discount this, take one pcb from a batch that is giving you solder balls and pass it through you reflow oven with no paste or components on (bare pcb)using your normal reflow prof

Yestech AOI question

Electronics Forum | Thu Dec 16 14:50:49 EST 2010 | rway

What Derek means is, you will have to train new templates from time to time, something you have to do with every AOI. Because there is no established method for marking parts, these markings can change. For instance, the text on chip resistors coul

First piece PCBA validation

Electronics Forum | Wed May 25 17:56:24 EDT 2011 | rssimmons

The SimmScope is an first article inspection system that uses an overhead digital microsope on a motorized gantry to inspect the board - much like an AOI - except that it does not automatically make the pass/fail decisions. It is up to the operator t

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