Electronics Forum: board (Page 958 of 1638)

Stencil Fiducials

Electronics Forum | Fri Feb 16 14:14:07 EST 2007 | wrongway

we use A EKRA X5 it can use A pad our the fiducial I generaly use A pab becuse most of our stencil don't come with the fiducials on them and our boards our HASAL and the fids our domed most of the time the smt pads work better for me

Lead manufacturing to lead free transisition

Electronics Forum | Tue Feb 27 12:45:08 EST 2007 | russ

Boy it is good to see the wave master back in action! I mean really guys, is Larry the only one here who knows that the lead turns into vapor in the oven and then in the cooling zones it falls back onto the board and creates the solder joints? P.

DEK265gsx inconsistency in management f

Electronics Forum | Fri Feb 23 08:51:38 EST 2007 | dekhead

Are you saying that it works in "no fmi" mode, but not in manual? Please tell me how it works in both. I'm asking you to change things to ascertain the problem, not as possible solution... if you can't get the board to stop in the correct position,

Clearance between Through hole and chip component

Electronics Forum | Wed Feb 28 11:43:20 EST 2007 | realchunks

Marcin, Think outside the box. If you are glueing the SMT part down, why not have an aperture cut in your stencil (or recut a stencil) between the SMT part and thru-hole. Wave solder hates SMT glue. This will get rid of your solder short problem

Scratches on BGA solder resist

Electronics Forum | Wed Feb 28 07:40:26 EST 2007 | realchunks

Hi Roderick, Guess it depends on how you define "minor". If it is just a visual blemish in the mask, there will be no affect o the BGA. If it is through the resist there may be a chance of solder shorting, which will affect it, I doubt it but poss

Stencil design

Electronics Forum | Fri Mar 02 00:21:38 EST 2007 | AMS

Hello, I havea 0.4mm pitch TQFP with heat transfer pad on the bottom side of component. I will appreciate any suggestions with regards to: 1) stencil thickness (Rest of components on board are 0603 passives and few 40 mil pitch IC's) 2) Stencil

No-Clean Solder

Electronics Forum | Mon Mar 05 13:22:20 EST 2007 | blnorman

We use (and have for some time) used No-clean on our radio boards with no problems. We also conformally coat with a platinum catalyzed, addition cure silicone coating with occassional problems. These silicones are prone to cure inhibition or retard

Bar Coding - auto print and apply solutions

Electronics Forum | Tue Mar 27 18:37:10 EDT 2007 | gregcr

I'm actually in the process of phasing in direct inkjet marking on my bare boards. The MEK based inks dry almost on contact, and the machines I have use a videojet excel HD printhead. I'm looking forward to see how it works for us. I think it may

BGA via in pad

Electronics Forum | Wed Mar 14 13:16:54 EDT 2007 | Shane

I have a customer that designed a fine pitch BGA into a board, and has put small vias in the middle of each pad on the PCB. Anyone have any ideas on how I can prevent the solder from the BGA from flowing through the vias and causing voids or no cont

BGA via in pad

Electronics Forum | Thu Mar 15 13:27:45 EDT 2007 | Pete

We had a customer do a similar thing. We notified our customer and educated them on what was happening. We were instructed to try one and report on the results, as the vias were supposed to be filled (and weren't). We pasted and reflowed and as su


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