Electronics Forum | Thu May 22 16:52:39 EDT 2008 | tonyamenson
Indium got back to me with the attached PDF. I always assumed, that in order to avoid thermal shock, there could not be any more than 80 degrees C difference between the solder pot and the pre-heated board. However, it would seem that any thing le
Electronics Forum | Thu May 29 14:57:26 EDT 2008 | rodrigo
Hi all, Is it normal for some of the small nozzles to be rejected by the wide view camera? Every time I do a nozzle centering the narrow view camera shows green circles for nozzles 1,2,3,4. The larger ones (5 and 6) show the asterisk. The wide view c
Electronics Forum | Tue Jul 22 09:35:06 EDT 2008 | dfhoadle
I hope that we have not lost much quality, but am still bothered by the way our select x is working. It seems to do very well when I can get the nozzle head within 5/1000 of an inch to the board as it passes. However, when I increase that distance
Electronics Forum | Wed Jul 16 18:21:20 EDT 2008 | emti
BGA Placement is not easy as we think, Mainly you have to make sure you don't have acceessive amount of paste, try to paste your board as it covers full ball, make sure it is not short before you place any part. If you placing the BGA by hand be car
Electronics Forum | Wed Jul 16 18:46:46 EDT 2008 | mariss
emti, Thank you for the reply but I'm looking for a reasonable quality pcb mfg. We do SMT and thru-hole in house (3 Juki KE-750L machines) of our product. My problem is with the bare boards: holes poorly registered with top copper, solder masks mis
Electronics Forum | Wed Sep 10 14:39:30 EDT 2008 | vladig
No, we didn't do the test you mentioned, but did EDS on the joints and didn't see carbon their (which would indicate the presence of any organic-based contaminant). For the customer the issue was closed and passed to the board shop. We did work with
Electronics Forum | Tue Sep 23 13:08:26 EDT 2008 | slthomas
Put the new stuff in the back and pull from the front. A pass through from stores makes that a lot easier. Bar codes are a wonderful thing if you can get people to use them. Wand it into stores then wand it sequentially into production via a queue.
Electronics Forum | Tue Nov 04 07:50:14 EST 2008 | davef
Sure. Here's what you should do to apply repeatable amounts of flux on BGA during rework: * Squirt some gel flux on a plate or something like that that has a flat bottom and raised sides to corral the flux. * Cut notches into one edge of an old credi
Electronics Forum | Thu Feb 12 11:57:59 EST 2009 | jmiller
i have searched the forum for hours. read all the threads that deals with cleanliness and ionic testing. (http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=40295) (http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=22603) (http://www.
Electronics Forum | Tue Mar 03 03:02:17 EST 2009 | emmanueldavid
25% out of Lands in PCB, Insufficient/Inconsistent Alloy deposition which causes for poor Tackiness between Device Spheres & Paste deposited. Also note that Aperture Opening Designs in Your Stencil draws a huge role for these defects. 4. Placement: P
.gif)
