Mirtec programming discussion

I'm guessing when you say bare board you mean wet paste only?

When you say the pads move slightly are your boards warped at all at the Vscore?

What we do is use per modual fids. first you delete or don't make panel fids and then theres a option when you right click the minimap for per modual fids. This will depending on your modual size stop all shifting of pads as the pad shifting is for us normaly caused by a difference in height camera to PCB as well as angle from warping.

Ya its generally best to have a mounting inspector on a reliable part of the part normally for say a sot23 i will take a mounting of the whole top + a bit of lead so theres a shiny white spot. This helps it find the part. then i will mask off the top of the part so labels wont interfere with mounting and i mask off any PCB showing so i can use it with the library on a different board. Then i add another mounting to find the label and for it i use enhance character to make the image black white and gray ile set acceptance to 60-70% and angle comp(allows rotation) to 5 degrees. both mounting inspectors can have polarity on (it only helps speed on a 3 legged part as it will never stick to the pads backwards and have all solder boxes pass). Then add solder boxes using vert lighting masking out about 50% of the pin top with binarise at 128 pass rate around 30-60%.

For side angle inspection you will need to drag the camera out of the current frame then you can change the camera and add your inspectors. For the basis mounting inspector on a side angle camera you will need to allow a large search area 100-200 in the direction the camera is pointing, and genearly 20-50 side to side of the camera (top to bottom for east and west). This is because as the board height from the camera changes so will its position on the side angle cameras. Both of these we had to figure out ourselves.

A undocumented feature I found just yesterday is that you can select more than 1 inspector in a part and right click there will be a Set OR-Function option and a Reset OR-Function. this will let you set a mounting inspector for 1 light type and another for another light type and if either of them pass both will pass and there will be no false defect. Helpful for when manufactures get lazy on there label quality, usually hor or user will work but not usually both, this fixes it.

O do you have a manual for 4.2.x? There is no manual yet for 4.5 as i have been told? If not a mirtec tech agent can get you setup with FTP so you can download the 4.2 manual, There usually pretty helpful. Your email mentioned koringlish and our 2?.?/2HT(no side angle) manual that came with our 3.5/MV3-L was of this accent. The 4.2 manual helps a lot more.

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I have experienced the same issue with the repair plus software not saving or displaying images properly when the defects are being reviewed. Have you asked Mirtec about it? What did they tell you? Curious to know.

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Good Morning Methos 1979,

I have worked with the Mirtec MV2 and 3 for several years. I did perform some evaluation of the red/blue filters. We found it to be usefull for some specialty solder inspections but we found it most usefull for solder inspection of plated test points.The standard solder inspection was not consistant as the plating on the surface of the part would not give a clear indication of where the test point and the solder joint boundaries were. The red/blue filters allowed us to clearly identify the component edges so we could perform a valid solder inspection.

I hope this is usefull.

Thanks

Chris

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Hello Scott,

Simply program the side angle cameras as you would for any other device using the downward camera. For instance, solder joint inspection for a PLCC would utilize a basis window, bridge inspection algorithm and individual solder joint inspection windows grouped together. The basis window will eliminate the false calls you are seeing due to component movement. You may also save this group to either the package library or the part number library. The user would then simply draq and drop the group from the respective library, rotate the group to the desired orientation and program around the device. We are pushing for future releases to incorporate side view frames as well.

For more tips on side view programming, please contact MIRTEC directly.

Thank you for your business Scott...

Brian D'Amico - President MIRTEC

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The big issue with the AOI machines is no tooling support. this makes side angle inspection a bit of a PITA. You can rig up some custom tooling to hold warped boards flat or just use bent aluminum strips on the sides to brace and correct warping in a panel.

For side angle inspection you will need to flip to the camera you want it on and then use the hand tool to move out of the current frame (the big border around the whole image part of the screen will disappear) you can then draw your mounting inspector on the part as well as group the part and link to the library.

when doing side angle mounting for part basis you must make your side to side search range wide (25-45 normally) and your up and down range search area huge (75-150 pixels on a 2meg machine).

A lot of the time I will base side angle inspectors off of a good fixed point with lots of high contrasting distinguishing features (Bright copper pad vr dark PCB, sharp edge of a component). The goal is not to do inspection with your bases mounting inspectors use them and program them for positioning only(IE mask off the labels of parts like always), add more mounting inspectors for labels fids and other stuff that are grouped to that part.

For all mounting inspectors used for positioning strong contrasting features are important and you need features it can align in X and Y on.

When placing a part from library for side angle you must drag off the current frame with the correct camera up. you can also set a new frame to use a different than normal camera after making the frame via frame lighting (rt click when nothing is selected).

For ceramic parts i generally favor the color inspector. BUT it is BUGGED and will not work by default. To work around the bug created in 4.x from 3.x you must rt click your desktop > properties > settings > troubleshooting > Set hardware acceleration to NONE > apply OK apply OK reboot.

without this any attempt to take a screen shot of the program will not save the image (because in a fruitless attempt to speed it up they have programmed 4.x to send the image right to the GFX card and the OS never gets to see it, This bypasses it). Now when you make a color inspector it can properly detect the color of the part you have drawing it on. The eye dropper tool to select color will also now work, as will the add and remove colors feature (lets you add additional valid colors like images to a mounting inspector). I prefer a 4x4 or 3x3 grid for chip caps and resistors with a R G B search range of 20 using the square option, you can always add more colors.

eadthem

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