Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


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bga rosh in a tin lead process


campos | 29 March, 2006

should I expect any issue using a lead free BGA with tin lead paste and oven profile???

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campos | 29 March, 2006

It depends on the end use of your product, but many people are reballing their leadfree BGA.

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campos | 3 April, 2006

When using lead free bgas and tin lead paste is almost certain that you will find voiding no matter what type of profile is use. The best thing that you can do is optimize your profile to minimize the voiding.

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campos | 3 April, 2006

look on the archice, you can find threads talking about same subject, like this for istance:


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