Solder Spheres, JEDEC Package Tolerances

In reviewing the JEDEC 95 guidelines (2002) there is not a mention of tolerances that have been agreed upon for today's finer pitch devices. There was no mention of the solder diameter tolerances (low melt temp) allowed for 0.8mm, 0.6mm and 0.5mm pitch devices. Does anyone know where this info can be found? Is there the same tolerance info anywhere for the "ddd" dimensional "Z" axis tolerance?

Can any of the solder vendors tell us how tight one can hold ball dimensions? Is this done via sorting with a mechanical sieve? We have experienced "out of spec" solder ball tolerances during the reballing process.

Thanks

BWET

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