Plating Rework

Common methods to replate components are: * Barrel plating http://www.finishing.com/Library/zemo/barrel.html

* Hot solder dipping - MIL-F-14072 M258

Certainly you can do this yourself by dipping the component leads into a solder pot containing leadfree solder. When taking this approach, be sure to monitor the lead-loading of the pot to maintain your lead level below 0.1 percent by weight.

For contract services try: * Specific Components Ltd; Unit 5, Brownlow Business Park, Darley St, Bolton, Lancashire, UK, BL1 3DX; 01204 396662 [from outside UK, +44 1204 396662]F 01204 396660 (from outside UK, +44 1204 396660 ) http://www.specific-components.co.uk

* Winslow Automation; 905 Montague Expway, Milpitas, CA 95035; 408-262-9004 F408-956-0199 http://www.winslowautomation.com * AEM; 11525 Sorrento Valley Rd, San Diego, CA 92121; 858-481-0210 http://www.aem-usa.com

* E-Certa Inc.; 3930 S. Walnut Ave, Bloomington, IN 47401; 812-323-7824 F 812-353-7777 http://www.e-certa.com * Klein Plating Works; 2020 Greengarden Rd, Erie, PA 16502-2132; 814-452-3793 F 814-452-3531 http://www.kleinplating.com

Documentation on hot solder dipping: * The Government Electronics and Information Technology Association [www.geia.org] is working on an industry standard GEIA-STD-0006 - Requirements for Using Solder Dip to Replace the Finish on Electronic Components. * Winslow Automation "Baseline Requirement for Hot Solder Dip" http://www.sixsigmaservices.com/newsandarticles/Baseline_Requirement_for_Hot_Solder_Dip.pdf

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