We have no experience with this termination, but in our notes => Silver palladium termination * AgPd-terminated capacitors are designed for conductive adhesion. Reflow or wave soldering is not recommended. [EPCOS Multilayer ceramic capacitors, Soldering directions, October 2006] * CONDUCTIVE EPOXY BONDING. Epoxy connection is a technically demanding technique. It requires the user to be familiar with the material requirements and reliability considerations of the conductor system chosen. ATC typically recommends either its gold over nickel barrier termination (termination style "CA") or its Ag/Pd alloy termination for compatibility with these applications.[Recommended Attachment Techniques for ATC Multilayer Chip Capacitors, Bulletin No. 201]. * To keep to external terminations of the resistors from separating from the body, compatible termination materials should be used. For example, if silver palladium [Ag-Pd] is used for the external terminations, Ag [2-2.5%] eutectic solder should be used. Please also carefully select the amount of solder used. [Precautions on the use of fixed resistors, Taiyo Yuden] * Silver palladium terminations are used for the large sizes 1812 and 2220 and for chips intended for conductive adhesion. This metallization improves the resistance of large chips to thermal shock. In case of conductive adhesion, the silver palladium metallization reduces susceptibility to corrosion. [Mounting Instructions for Chip Capacitors , Siemens Matsushita Components] * For application of the conductive paste bonding process, gold or silver-palladium is suitable as the electrode material. Accordingly, components using gold or silver-palladium electrodes are now in demand. Therefore, to meet the requirements for the conductive paste bonding process, Murata's newly developed components for automotive equipment use gold-plated electrodes. [Technical Trends > Eliminating and reducing Lead (Pb), Murata Electronics] * Hybrid assembly using conductive epoxy or wire bonding requires the use of silver palladium or gold terminations. Nickel barrier termination is not practical in these applications, as intermetallics will form between the dissimilar metals. The ESR will increase over time and may eventually break contact when exposed to temperature cycling. [Multilayer capacitors (MLC) Application Notes, Novacap]
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